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首页> 外文期刊>International Journal of Production Research >Automatic bubble defect inspection for microwave communication substrates using multi-threshold technique based co-occurrence matrix
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Automatic bubble defect inspection for microwave communication substrates using multi-threshold technique based co-occurrence matrix

机译:基于多阈值共现矩阵的微波通信基板气泡缺陷自动检测

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摘要

The microwave communication substrate is currently using manual inspection from ultrasonic image. The bubble defect ratio is an important index for evaluating the quality of the substrate. It is difficult to formalise standards for the quality inspection procedure by an operator since different numbers of bubbles may be realised. This paper proposes a novel inspection procedure for the calculation of the bubble ratio of microwave communication substrate. First, the optimal threshold is determined for binary image segmentation on the basis of a co-occurrence matrix. Further, the image of the microwave communication substrate is divided into three parts, namely, the image skeleton area, soldering area, and IC working area. The image subtraction technique is used to obtain the global and critical regions for bubbles. After data analysis, if the critical region bubble ratio is larger than 10% of the critical region, then it is judged to be a defect. When a substrate is judged to be non-defective, we should further proceed with the global area detection. If the global region bubble ratio is larger than 12.3% of the global region, then it is judged as a defect. An experiment was conducted to demonstrate the application of this technique. The results showed that the inspection accuracy reached 97.49%. The results of this study provide an effective solution for the inspection of the interface bond quality of a microwave communication substrate.
机译:微波通信基板目前正在根据超声波图像进行人工检查。气泡缺陷率是评估基板质量的重要指标。由于可能实现不同数量的气泡,因此操作者难以正式确定质量检查程序的标准。本文提出了一种新颖的检查程序,用于计算微波通信基板的气泡率。首先,基于共现矩阵确定用于二值图像分割的最佳阈值。此外,微波通信基板的图像被分为三个部分,即图像骨架区域,焊接区域和IC工作区域。图像减法技术用于获得气泡的全局和临界区域。经过数据分析,如果临界区气泡率大于临界区的10%,则判断为缺陷。当判断出基材无缺陷时,我们应该进一步进行全局区域检测。如果全球区域气泡率大于全球区域的12.3%,则将其判断为缺陷。进行了实验以证明该技术的应用。结果表明,检测精度达到97.49%。这项研究的结果为检查微波通信基板的界面结合质量提供了有效的解决方案。

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