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Enabling a compact model to simulate the RF behavior of MOSFETs in SPICE

机译:启用紧凑模型以模拟SPICE中MOSFET的RF行为

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摘要

A detailed methodology for implementing a MOSFET model valid to perform RF simulations is described in this article. Since the SPICE-like simulation programs are used as a standard tool for integrated circuit (IC) design, the resulting model is oriented for its application under the SPICE environment. The core of the proposed model is the popular BSIM3v3, but in this model the RF effects are taken into account by means of extrinsic lumped elements. Good agreement between the simulated and measured small-signal S-parameter data is achieved for a 0.18-mu m channel-length MOSFET, thus validating the proposed model. (c) 2005 Wiley Periodicals, Inc.
机译:本文介绍了用于执行可有效执行RF仿真的MOSFET模型的详细方法。由于类似SPICE的仿真程序被用作集成电路(IC)设计的标准工具,因此所得模型针对其在SPICE环境下的应用而定位。所提出模型的核心是流行的BSIM3v3,但是在该模型中,通过非本征集总元件考虑了RF效应。对于0.18微米沟道长度MOSFET,在仿真信号和测量的小信号S参数数据之间取得了良好的一致性,从而验证了所提出的模型。 (c)2005年Wiley Periodicals,Inc.

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