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首页> 外文期刊>JSME International Journal. Series B, Fluids and Thermal Engineering >Experimental Study of Filler Insertion Effect on Mean Thermal Contact Conductance
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Experimental Study of Filler Insertion Effect on Mean Thermal Contact Conductance

机译：填料插入对平均热接触电导率影响的实验研究

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摘要

A series of experiments have been performed to investigate the filler insertion effect on the temperature drop at the wavy contact interface ΔT and the mean thermal contact conductance h{sub}(m,f). Representative behavior of Ar against the mean nominal contact pressure p{sub}m is clarified, and the effect of an interval of time on Ar is shown for the silicone filler with thickness δf{sub}0 = 2 mm. The silicone elastomer is proved effective to increase h{sub}(m,f) despite its low thermal conductivity. Further, it is shown that h{sub}(m,f) of 0.5 mm thick silicone filler becomes two to three times higher than that of bare contact under the unloading process. However, it is also shown that h{sub}(m,f) decreases with increasing δf{sub}0, therefore filler insertion with improper thickness results in a reverse effect on increase in h{sub}(m,f). As for metallic filler insertion using an aluminum or a copper foil, only a little improvement in h{sub}(m,f) is obtained in spite of its high thermal conductivity.
机译：已经进行了一系列实验来研究填料插入对波状接触界面处的温度下降ΔT和平均热接触电导率h {sub}（m，f）的影响。阐明了Ar相对于平均名义接触压力p {sub} m的代表性行为，并且对于厚度为δf{sub} 0 = 2 mm的有机硅填料，显示了时间间隔对Ar的影响。尽管硅氧烷弹性体的导热系数低，但已证明可有效提高h {sub}（m，f）。此外，显示出在卸载过程中，0.5mm厚的硅树脂填料的h {sub}（m，f）变得比裸露接触的h {sub}（m，f）高两倍至三倍。但是，还显示出h {sub}（m，f）随δf{sub} 0的增加而降低，因此，厚度不适当的填料插入会对h {sub}（m，f）的增加产生相反的影响。对于使用铝或铜箔的金属填充物的插入，尽管h {sub}（m，f）具有很高的导热性，但仅获得了很小的改善。

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