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Condition Monitoring of Wind Power Converters Using Heat Flux Sensor

机译:使用热通量传感器的风电变流器状态监测

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摘要

The application of the gradient heat flux sensor as a failure and aging indicator of the power electronics was studied in this paper. Conducted experiments shown that the heat flux sensor attached to the insulated-gate bipolar transistor's (IGBT's) base plate can provide realtime heat flux monitoring. Condition monitoring (CM) model implemented in wind turbine based on online comparison of measured IGBT heat flux and expected power losses was proposed. The deviation of the measured heat flux from the expected power losses was detected during IGBT's package related failures. The maximum deviation of 30% was obtained from the module with broken bond wire. The IGBT's package related degradation mechanisms were modeled by the Finite Element Method (FEM) in order to validate experimental observations. The obtained results have shown that in order to accurately estimate the possible deviation of power losses of the degraded IGBT, the exact change in thermo-electric parameters of IGBT in different failure mechanisms, environmental conditions and operating temperatures should be taken into account.
机译:本文研究了梯度热通量传感器作为电力电子设备的故障和老化指标的应用。进行的实验表明,连接到绝缘栅双极晶体管(IGBT)底板的热通量传感器可以提供实时热通量监控。提出了一种基于在线测量的IGBT热通量和预期功率损耗的风力发电机状态监测(CM)模型。在IGBT的封装相关故障期间,检测到测量的热通量与预期的功率损耗之间的偏差。从断线的模块获得最大偏差为30%。为了验证实验观察结果,通过有限元方法(FEM)对IGBT封装相关的退化机理进行了建模。获得的结果表明,为了准确估计退化的IGBT的功率损耗的可能偏差,应考虑不同故障机制,环境条件和工作温度下IGBT热电参数的精确变化。

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    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Lappeenranta University of Technology, Lappeenranta, Finland, P.O. Box 20, Lappeenranta, FI-53851;

    Saint-Petersburg State Polytechnical University, Russia, Saint-Petersburg, 195251, Polytechnicheskaya 29;

    Saint-Petersburg State Polytechnical University, Russia, Saint-Petersburg, 195251, Polytechnicheskaya 29;

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  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Condition Monitoring; IGBT Module; Failure Mechanism; Heat Flux Sensor; Wind Turbine;

    机译:状态监测;IGBT模块失败机制;热通量传感器;风力发电机;

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