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首页> 外文期刊>ISIJ international >Hydrogen Embrittlement Susceptibility Evaluation of Tempered Martensitic Steels Showing Different Fracture Surface Morphologies
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Hydrogen Embrittlement Susceptibility Evaluation of Tempered Martensitic Steels Showing Different Fracture Surface Morphologies

机译：表现出不同断口形貌的回火马氏体钢的氢脆敏感性

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摘要

The effects of the crosshead speed, hydrogen content and temperature on fracture strength and fracture surface morphology were investigated using a tempered martensitic steel containing 1.67 mass% of Si (H-Si) and one containing 0.21 mass% of Si (L-Si). When L-Si specimens were charged with a small amount of hydrogen, fracture surfaces showed a transition from quasi-cleavage (QC) to intergranular-like (IG-like) to intergranular (IG) at room temperature. In contrast, when H-Si specimens were charged with a small amount of hydrogen, fracture surfaces showed a transition from QC to IG-like at room temperature. This transition in the fracture surface morphology can be explained by the magnitude relationship between intergranular and transgranular strengths under hydrogen charging. At a temperature of — 196℃, hydrogen did not lower the fracture strength nor did it change the fracture surface morphology. Hence, hydrogen embrittlement at room temperature was presumably caused by hydrogen accumulation and lattice defect formation during stress application as well as by hydrogen trapped before stress was applied. Fracture strength decreased and converged to a constant value (lower critical stress) with decreasing crosshead speed. The crosshead speed for obtaining lower critical stress decreased as the fracture surface changed from IG to IG-like to QC. Therefore, the crosshead speed for obtaining lower critical stress should not be treated as a constant but should be determined experimentally for each type of fracture surface.
机译：使用含有1.67质量％的Si（H-Si）和含有0.21质量％的Si（L-Si）的回火马氏体钢，研究了十字头速度，氢含量和温度对断裂强度和断裂表面形态的影响。当L-Si样品中充有少量氢时，在室温下，断口表面显示出从准裂解（QC）到晶间状（IG状）到晶间（IG）的转变。相反，当H-Si样品中充有少量氢时，在室温下，断裂表面显示出从QC到IG的转变。裂缝表面形态的这种转变可以用氢充注下的晶间和跨晶强度之间的大小关系来解释。在196℃的温度下，氢不会降低断裂强度，也不会改变断裂表面的形态。因此，室温下的氢脆可能是由应力施加期间的氢积累和晶格缺陷形成以及施加应力之前捕获的氢引起的。随着十字头速度的降低，断裂强度降低并收敛至恒定值（较低的临界应力）。随着断裂面从IG变为IG样再到QC，获得较低临界应力的十字头速度降低。因此，用于获得较低临界应力的十字头速度不应视为常数，而应针对每种类型的断裂面通过实验确定。

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