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首页> 外文期刊>ISIJ international >Microstructural Analysis of Infrared Brazed Ti-6Al-4V and Nb Using the Ti-15Cu-25Ni Foil
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Microstructural Analysis of Infrared Brazed Ti-6Al-4V and Nb Using the Ti-15Cu-25Ni Foil

机译：Ti-15Cu-25Ni箔对红外钎焊Ti-6Al-4V和Nb的显微组织分析

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摘要

Microstructural analysis of infrared brazed Ti-6Al-4V and Nb at 970℃ using the clad Ti-15Cu-25Ni filler metal has been performed in the experiment. For the 180s brazed specimen, at first primary Ti_2Cu, Ti_2Ni as well as eutectic microstructure are obtained upon cooling cycle of brazing, and maximum amounts of Ti_2Cu and Ti_2Ni are observed at the brazed joint. The amount of transient Ti_2Cu and Ti_2Ni intermetallics is decreased with increasing the brazing time due to depletion of Cu and Ni from the braze into the Ti-6Al-4V substrate. Diffusion of Cu and Ni into Ti-6Al-4V substrate results in isothermal solidification rather than eutectic solidification of the molten braze, and the region of transformed β-Ti is broadened as the brazing time increased to 600s and 1 200s. For the 3600s brazed specimen, Ti_2Cu, Ti_2Ni and transformed β-Ti are vanished from the infrared brazed joint. Disappearance of Ti_2Cu and Ti_2Ni intermetallics for the longer brazing time makes Ti-15Cu-25Ni filler metal with a great potential in future applications.
机译：在实验中，采用Ti-15Cu-25Ni复合填充金属对Ti-6Al-4V和Nb进行了红外钎焊的显微组织分析。对于180年代的钎焊样品，在钎焊冷却循环后，首先获得了初生Ti_2Cu，Ti_2Ni和共晶组织，并且在钎焊接头处观察到了最大量的Ti_2Cu和Ti_2Ni。过渡金属Ti_2Cu和Ti_2Ni的过渡金属含量随着钎焊时间的增加而减少，这是由于铜和镍从钎料进入Ti-6Al-4V基体中的消耗所致。 Cu和Ni扩散到Ti-6Al-4V基体中导致熔融钎焊的等温凝固而不是共晶凝固，并且随着钎焊时间增加到600s和1200s，转变的β-Ti区域变宽。对于3600s钎焊试样，红外钎焊接头消失了Ti_2Cu，Ti_2Ni和转变后的β-Ti。 Ti_2Cu和Ti_2Ni金属间化合物消失的时间越长，使得Ti-15Cu-25Ni钎料在未来的应用中具有很大的潜力。

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