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首页> 外文期刊>ISIJ international >Numerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal
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Numerical Modeling of the Transient Liquid-phase Diffusion Bonding Process of Al Using Cu Filler Metal

机译：铜填充金属对铝的瞬态液相扩散结合过程的数值模拟

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摘要

A numerical modeling of dissolution and isothermal solidification during the transient liquid-phase (TLP) diffusion bonding process of Al using pure Cu filler metal based on a diffusion-controlled model was carried out. In the modeling, both the changes in volume accompanying interdiffusion between the base metal (All and the filler metal (Cu) and the solid-liquid transformation were taken into account by using variable grids. The effect of a load applied to the base metal was also examined by considering simple force balance among the surface and interface energies of the base metal and liquid formed in the bonding region. The early dissolution process simulated by the developed mode) agreed with the experimental results, and the predicted isothermal solidification time of a sample with an applied load also agreed with the experimental results.
机译：基于扩散控制模型，对纯铜填充金属在铝的瞬态液相扩散键合过程中的溶解和等温凝固过程进行了数值模拟。在建模中，通过使用可变网格考虑了母材（Al和填充金属（Cu）之间相互扩散引起的体积变化以及固液转变）的影响，载荷对母材的影响为还通过考虑在键合区域中形成的贱金属和液体的表面能和界面能之间的简单力平衡进行了检验（开发模式模拟的早期溶解过程）与实验结果相符，并且预测了样品的等温凝固时间施加负载也与实验结果一致。

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