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Interfacial Reactions in the Joining of Si_3N_4/Si_3N_4 with Newly Developed CuNiTiB Brazing Alloy

机译:Si_3N_4 / Si_3N_4与新开发的CuNiTiB钎焊合金接合时的界面反应

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摘要

Joining of Si_3N_4/Si_3N_4 was carried out with a newly developed Cu_(66)Ni_(10)Ti_(21)B_1 brazing alloy. With the powdered new brazing alloy, the shear strength of the joints reaches 233 MPa. With the rapidly-solidified foils of the brazing alloy, the three-point bend strength of the joints is raised to 406 MPa at room temperature and this value is kept steady until 723K. The interfacial ractions of the joint and its effects on the joint strength are discussed. The lattice matching between Si_3N_4 and Ti_5Si_3 is better than that between Si__3N_4 and TiN. So the formation of Ti_5Si_3 rather than TiN at the interface is favorable to the joint strength. Adding element NI to Cu-Ti aloy can weaken the activity of Ti in the alloy, which is favorable to decrease the thickness of interfacial reaction layer and in the result the joint strength is increased. An adding a small amount of B in the new alloy can decrease its liquidus temperature.
机译:用新开发的Cu_(66)Ni_(10)Ti_(21)B_1钎焊合金进行了Si_3N_4 / Si_3N_4的接合。使用粉末状新钎焊合金时,接头的剪切强度达到233 MPa。使用快速凝固的钎焊合金箔,在室温下,接头的三点弯曲强度提高到406 MPa,并且该值保持稳定,直到723K。讨论了关节的界面特性及其对关节强度的影响。 Si_3N_4和Ti_5Si_3之间的晶格匹配优于Si__3N_4和TiN之间的晶格匹配。因此,在界面处形成Ti_5Si_3而不是TiN有利于连接强度。将元素NI添加到Cu-Ti合金中可削弱合金中Ti的活性,这有利于减小界面反应层的厚度并因此提高了接合强度。在新合金中添加少量的B可以降低其液相线温度。

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