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Nondestructive fault localization of IC interconnection by using ultrasonic heating

机译：利用超声波加热对IC互连进行无损故障定位

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摘要

A nondestructive method of ultrasonic fault localization of IC interconnection without mold decapsulation was proposed instead of the optical-beam-induced resistance change (OBIRCH) method. The signal principle of the proposed method is based on the resistance change induced by local ultrasonic heating. To investigate the principle, numerical analysis constructed by sound and temperature field simulations is carried out and its results were compared with experimental results. The sound field is calculated by Fourier analysis. The temperature field is discretized using an equivalent thermal network circuit. Numerical simulation results show a good agreement with experimental results, suggesting that the signal in the proposed method was induced by ultrasonic heating. Moreover, ultrasonic heating induced the signal of the proposed method in a sample covered with commercially available resin including fillers (average diameter: 16 mu m), and electro-static discharge (ESD) damage was localized by ultrasonic heating without mold decapsulation. These results suggest that the signal induced by ultrasonic stimulation is detectable and available for use in analysis. (C) 2017 The Japan Society of Applied Physics
机译：提出了一种无需模具脱封的集成电路互连超声故障定位的无损方法，代替了光束诱导电阻变化法（OBIRCH）。该方法的信号原理基于局部超声加热引起的电阻变化。为了研究该原理，通过声场和温度场模拟进行了数值分析，并将其结果与实验结果进行了比较。通过傅立叶分析计算声场。使用等效热网络电路离散温度场。数值模拟结果与实验结果吻合良好，表明所提出方法中的信号是由超声加热引起的。此外，在用市售的包括填料的树脂（平均直径：16μm）覆盖的样品中，超声加热引起了所提出方法的信号，并且通过超声加热使静电放电（ESD）损伤得以定位，而没有脱模。这些结果表明，由超声刺激引起的信号是可检测的并且可用于分析。 （C）2017日本应用物理学会

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  • 来源
    《Japanese journal of applied physics》 |2017年第7s1期|07JC11.1-07JC11.6|共6页
  • 作者

    Matsui Takuto; Hozumi Naohiro; Otaka Akihiro; Matsumoto Toru;

  • 作者单位

    Toyohashi Univ Technol, Dept Elect & Elect Informat Engn, Toyohashi, Aichi 4418580, Japan;

    Toyohashi Univ Technol, Dept Elect & Elect Informat Engn, Toyohashi, Aichi 4418580, Japan;

    Hamamatsu Photon KK, Hamamatsu, Shizuoka 4308587, Japan;

    Hamamatsu Photon KK, Hamamatsu, Shizuoka 4308587, Japan;

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