机译:具有各种自对准浅沟槽隔离深度的50nm以下NAND闪存器件的特性
Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan;
Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;
机译:具有浅沟槽隔离技术的130mm / sup 2 /,256 Mbit NAND闪存
机译:Ti自对准硅化物在浅沟槽Si隔离结构中引起的应变的束流电子衍射研究
机译:LDD深度变化对SONOS NAND闪存设备性能特性的影响
机译:自对准浅沟槽隔离凹槽对42nm NAND闪存的单元性能和可靠性的影响
机译:闪存(NAND)微加工中的浅沟槽隔离工艺。
机译:用于NAND闪存设备的压缩辅助自适应ECC和RAID分散
机译:采用浅沟槽隔离的深亚微米VLsI CmOs器件的闭合背栅偏置相关反向窄通道效应模型