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Characteristics of Sub-50nm NAND Flash Devices with Various Self-Aligned Shallow Trench Isolation Depths

机译:具有各种自对准浅沟槽隔离深度的50nm以下NAND闪存器件的特性

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摘要

The program efficiency and endurance characteristics of sub-50 nm NAND flash devices with various self-aligned shallow trench isolation (SA-STI) depths are investigated. Although a large SA-STI depth improves the neighboring floating gate coupling issue and gate coupling ratio, a low program efficiency is also introduced. In addition, lower endurance characteristics are observed in the device with a large SA-STI depth than in the device with a small SA-STI depth. The mechanisms underlying such unfavorable results are discussed on the basis of experimental data and technology computer-aided design simulations.
机译:研究了具有各种自对准浅沟槽隔离(SA-STI)深度的亚50 nm NAND闪存器件的编程效率和耐用性。尽管较大的SA-STI深度改善了相邻的浮栅耦合问题和栅极耦合率,但是也引入了低编程效率。另外,在SA-STI深度大的设备中观察到比在SA-STI深度小的设备中低的耐久特性。在实验数据和技术计算机辅助设计仿真的基础上,讨论了产生这种不利结果的机制。

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  • 来源
    《Japanese journal of applied physics》 |2013年第11issue2期|11NA06.1-11NA06.4|共4页
  • 作者单位

    Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan;

    Institute of Microelectronics, Department of Electrical Engineering, and Advanced Optoelectronic Technology Center, National Cheng Kung University, Tainan 701, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

    Device Technology Group, Powerchip Technology Corporation, Hsinchu 300, Taiwan;

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