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首页> 外文期刊>Japanese journal of applied physics >Laminated Capacitor Formed in Thermoplastic Resin Substrate by Laser-Assisted Micropowder Jet Implantation
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Laminated Capacitor Formed in Thermoplastic Resin Substrate by Laser-Assisted Micropowder Jet Implantation

机译：激光辅助微粉射流注入在热塑性树脂基底中形成的叠层电容器

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摘要

A laminated capacitor has been formed in a poly(oxymethylene) substrate of the thermoplastic resin by a laser-assisted micro powder jet implantation method. A carbon powder and a BaTiO_3 powder were jetted for an electrode and a dielectric in turn with Ar gas while irradiating a Nd:YAG laser on the substrate, respectively. It was confirmed that the capacitance formed by this method was proportional to size of electrode areas and number of laminations. The dielectric constant estimated experimentally showed a large value of 5.2 × 10~3, which was probably enhanced by BaTiO_3 particles crushed to a particle size of approximately 150 nm through the jetting process. It was found that the capacitance showed an exponential dependence against the coming and going repetition number of times of powder jetting at formation of the dielectric layer, which is probably affected by both the increase in the thickness and the decrease in the dielectric constant according to the number of dielectric laminations.
机译：通过激光辅助的微粉末喷射注入法在热塑性树脂的聚（甲醛）基板上形成了层叠电容器。将碳粉和BaTiO_3粉末依次用Ar气体喷射到电极和电介质上，同时分别在基板上照射Nd：YAG激光。证实了通过这种方法形成的电容与电极面积的大小和叠片的数量成比例。实验估计的介电常数显示出较大的5.2×10〜3值，这可能是通过通过喷射工艺将BaTiO_3颗粒压碎成大约150 nm的粒径而增强的。已经发现，在介电层形成时，电容对粉末喷射的来回重复次数呈指数依赖性，这可能受厚度的增加和介电常数的降低的影响。电介质叠片的数量。

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  • 来源
    《Japanese journal of applied physics》 |2013年第6issue2期|06GL02.1-06GL02.4|共4页
  • 作者

    Katsuhiko Suzuki; Shotaroh Kameya; Tohru Sugai; Takumi Ohuchi; Kaichi Miura; Tsunemoto Kuriyagawa;

  • 作者单位

    Department of Production System Engineering, Sendai National College of Technology, Natori, Miyagi 981-1239, Japan;

    Department of Production System Engineering, Sendai National College of Technology, Natori, Miyagi 981-1239, Japan;

    Department of Production System Engineering, Sendai National College of Technology, Natori, Miyagi 981-1239, Japan;

    Department of Materials Science and Engineering, Sendai National College of Technology, Natori, Miyagi 981-1239, Japan;

    Miura Sensor Research Corporation, Sendai 981-3203, Japan;

    Department of Nanomechanics, Tohoku University, Sendai 980-8579, Japan;

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