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机译:有机添加剂对化学机械抛光后多晶硅膜表面粗糙度的影响
Advanced Semiconductor Materials and Devices Development Center, Hanyang University, Seoul 133-791, Korea Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea;
Advanced Semiconductor Materials and Devices Development Center, Hanyang University, Seoul 133-791, Korea Department of Electronics and Communications Engineering, Hanyang University, Seoul 133-791, Korea;
Advanced Semiconductor Materials and Devices Development Center, Hanyang University, Seoul 133-791, Korea Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea;
Division of Advanced Materials Science Engineering, Hanyang University, Seoul 133-791, Korea;
Advanced Semiconductor Materials and Devices Development Center, Hanyang University, Seoul 133-791, Korea Department of Nanoscale Semiconductor Engineering, Hanyang University, Seoul 133-791, Korea Department of Electronics and Communications Engineering, Hanyang University, Seoul 133-791, Korea;
机译:通过化学机械抛光的多晶硅膜制造薄膜晶体管
机译:TiO_2薄膜化学机械抛光中表面粗糙度的研究。
机译:碱性浆料中过氧化氢对化学机械抛光中多晶Ge2Sb2Te5薄膜抛光速率的影响
机译:改进化学机械抛光多晶硅膜上的薄膜晶体管(TFT)特性
机译:用于微电子应用中的多晶硅,二氧化硅和氮化硅膜化学机械抛光的新型浆料配方和相关机理。
机译:机械和化学抛光技术对热聚合和可见光聚合丙烯酸义齿基料树脂表面粗糙度的影响
机译:采用非吸收化学 - 机械抛光,GaAs晶片表面平滑粗糙度模型