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首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Fabrication and Mechanical Characterization of Micro Electro Mechanical System Based Vertical Probe Tips for Micro Pad Measurements
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Fabrication and Mechanical Characterization of Micro Electro Mechanical System Based Vertical Probe Tips for Micro Pad Measurements

机译：基于微机电系统的垂直探头尖端的制造和机械表征，用于微焊盘测量

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As a result of new developments in semiconductor technology, the number of pads per unit area is increasing and pad arrays are becoming irregular. Therefore, there is an increased need for a versatile probe card to address these issues. We developed a vertical micro electro mechanical system (MEMS) probe tip that is usable in a small pad (approximately 100μm) and a two-dimensional pad array. The main process used to produce the tip was wafer bonding, silicon etching by deep reactive ion etcher (RIE) and electro-plating. The material of the electro-plated probe tip was an Ni-Co alloy. To optimize the design of the vertical probe tip, we designed various models and measured them in a micro compression and tensile tester. The structural analyses of the probe tip were accomplished using finite element method (FEM) and compared with actual measurement values. In this study, we demonstrated the potential of the vertical probe tip applied to a small area with the over drive (O.D.) of 10-40 蘭 and the contact force of 1-8gf.
机译：由于半导体技术的新发展，每单位面积的焊盘数量正在增加，并且焊盘阵列正变得不规则。因此，越来越需要一种通用的探针卡来解决这些问题。我们开发了一种垂直微机电系统（MEMS）探针头，该探针头可用于小焊盘（约100μm）和二维焊盘阵列中。产生尖端的主要过程是晶片键合，通过深反应离子刻蚀机（RIE）进行的硅蚀刻以及电镀。电镀探针头的材料是镍钴合金。为了优化垂直探针的设计，我们设计了各种模型，并在微型压缩和拉伸测试仪中对其进行了测量。探针的结构分析是使用有限元方法（FEM）完成的，并与实际测量值进行了比较。在这项研究中，我们证明了垂直探头尖端在10-40兰的过驱动（O.D.）和1-8gf的接触力下应用于小区域的潜力。

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