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首页> 外文期刊>Japanese Journal of Applied Physics. Part 1, Regular Papers, Brief Communications & Review Papers >Impact of Aggressively Shallow Source/Drain Extensions on Device Performance
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Impact of Aggressively Shallow Source/Drain Extensions on Device Performance

机译:过度浅的源极/漏极扩展对设备性能的影响

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We investigated by numerical simulations the effect of aggressive reduction of the source/drain extension (SDE) depth X, on the performance of a metal-oxide-semiconductor field-effect transistor (MOSFET) of the 45-nm technology node. As an extreme case, the charge-transfer-doped SDE MOSFET (CTE-MOS), which has inversion-layer SDEs induced by surface charges, was considered. Assuming that the gate length L_g fluctuation was ±20%, the substrate doping was set so that the off-state current was a specified value at L_g = -20%, and the resulting drive current I_(on) at L_g = +20% was evaluated. When X_j was reduced from 9.5 to 2.0 nm under a fixed impurity density of 2 x 10~(20) cm~(-3), I_(on) increased by ~27% because the SDF, resistance increase was compensated for by the reduction of the short-channel effects. CTE-MOS exhibited a still better performance: 1-1.3 times I_(on) and 1.1-1.4 times the reciprocal intrinsic delay at L_g = +20% with 1.5-2.5 times the gate oxide thickness compared with the conventional MOSFETs with X_j = 9.5 nm. The feasibility of the CTE was experimentally demonstrated by the formation of electron inversion layers induced with Cs ions implanted into thermal oxide.
机译:我们通过数值模拟研究了源/漏扩展(SDE)深度X的主动减小对45纳米技术节点的金属氧化物半导体场效应晶体管(MOSFET)的性能的影响。在极端情况下,考虑了电荷转移掺杂的SDE MOSFET(CTE-MOS),其具有由表面电荷诱导的反转层SDE。假设栅极长度L_g波动为±20%,设置衬底掺杂,以使截止状态电流在L_g = -20%时为指定值,并且在L_g = + 20%时得到的驱动电流I_(on)被评估。当X_j在2 x 10〜(20)cm〜(-3)的固定杂质密度下从9.5 nm减小到2.0 nm时,由于SDF,I_(on)增加了约27%,电阻的增加被减少了补偿短通道效应。 CTE-MOS表现出更好的性能:与X_j = 9.5的传统MOSFET相比,L_g = + 20%时互为本征延迟的1-1.3倍I_(on)和互逆本征延迟的1.1-1.4倍,栅氧化层厚度为1.5-2.5倍纳米通过用注入热氧化物中的Cs离子诱导的电子反型层的形成,实验证明了CTE的可行性。

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