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机译:n型(Bi_(1-x)Sb_x)_2Te_3合金的热压性能
The School of Materials Science, Japan Advanced Institute of Science and Technology, Ishikawa 923-1292, Japan;
hot-pressed n-type Bi_(1.8)Sb_(0.2)Te_3 alloy; thermoelectric dimensionless figure of merit; seebeck coefficient; thermal conductivity; electrical resistivity; two-conduction-band model;
机译:嵌入纳米粒子的(Bi_(1-x)Sb_x)_2Te_3合金的晶格热导率
机译:机械合金化和脉冲放电烧结制备(Bi_(1-x)Sb_x)_2Te_3热电材料的结构和传输性能
机译:氢气环境下退火的p型(Bi_(1-x)Sb_x)_2Te_3薄膜的热电性能
机译:机械合金化制备p型(Bi_(1-x)Sb_x)2Te_3的热电性能
机译:UV /臭氧诱导硅(1-x)锗(x)合金的氧化和氧化膜的热脱附。
机译:Pd掺杂对n型Cu0.008Bi2Te2.7Se0.3合金电学和热学性能的影响
机译:PD掺杂对n型Cu0.008bi2te2.7se0.3合金电气和热性能的影响