...
首页> 外文期刊>Japanese Journal of Applied Physics. Part 2, Letters >Data Retention Improvement of Metal-Oxide-Nitride-Oxide-Semiconductor Memories Using Silicon-Tetrachloride-Based Silicon Nitride with Ultralow Si-H Bond Density
【24h】

Data Retention Improvement of Metal-Oxide-Nitride-Oxide-Semiconductor Memories Using Silicon-Tetrachloride-Based Silicon Nitride with Ultralow Si-H Bond Density

机译:使用具有超低Si-H键密度的四氯化硅基氮化硅改善金属氧化物-氮化物-氧化物-半导体存储器的数据保留

获取原文
获取原文并翻译 | 示例
           

摘要

We have improved the data retention of metal-oxide-nitride-oxide-semiconductor (MONOS) memories by reducing the Si-H bond density in silicon nitride. This marked improvement was achieved by depositing silicon nitride with NH_3 and SiCl_4 (silicon tetrachloride, STC), instead of with NH_3 and the conventionally used SiCl_2H_2 (dichlorosilane, DCS). The Si-H bond density of the STC-based nitride was less than 1% that of the DCS-based nitride. We clarified that the improvement was due to the suppression of the leakage of trapped electrons through shallow traps which are related to Si-H bonds with an activation energy of 0.1-0.2 eV.
机译:通过降低氮化硅中的Si-H键密度,我们提高了金属氧化物,氮化物,氧化物半导体(MONOS)存储器的数据保留能力。通过用NH_3和SiCl_4(四氯化硅,STC)而不是NH_3和常规使用的SiCl_2H_2(二氯硅烷,DCS)沉积氮化硅,可以实现这种显着改善。 STC基氮化物的Si-H键密度小于DCS基氮化物的1%。我们明确指出,这种改进是由于抑制了电子通过浅陷阱捕获的电子泄漏所致,这些浅陷阱与活化能为0.1-0.2 eV的Si-H键有关。

著录项

相似文献

  • 外文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号