...
首页> 外文期刊>Japanese journal of applied physics >Impacts of surface C/Si ratio on in-wafer uniformity and defect density of 4H-SiC homo-epitaxial films grown by high-speed wafer rotation vertical CVD
【24h】

Impacts of surface C/Si ratio on in-wafer uniformity and defect density of 4H-SiC homo-epitaxial films grown by high-speed wafer rotation vertical CVD

机译:表面C / ​​Si比对高速晶圆旋转垂直CVD生长的4H-SiC同质外延膜的晶圆内均匀度和缺陷密度的影响

获取原文
获取原文并翻译 | 示例
           

摘要

Surface C/Si ratio was demonstrated as a useful indicator for the control of in-wafer distribution of thickness and carrier concentration in 4H-SiC homo-epitaxial films on large-diameter wafers. Close investigation of the dependence of growth rate and carrier concentration on the radial distance from the center of the 150 mm wafer revealed that the actual C/Si ratio just above the wafer: surface C/Si ratio, is quite different to the introduced C/Si ratio. In-wafer distribution of thickness and carrier concentration in the epitaxial films can be explained by the surface C/Si ratio, which suggests that the surface C/Si ratio could be a useful indicator for the precise control of uniform growth on large-diameter wafers. It is also found that two types of SiC films, one with extremely low defect density and the other with low pit density, both with highly uniform growth rate and carrier concentration, could be grown by controlling of the surface C/Si ratio on the whole wafers. (C) 2019 The Japan Society of Applied Physics
机译:结果表明,表面C / ​​Si比可作为控制大直径晶片上4H-SiC同质外延膜厚度和载流子浓度的晶片内分布的有用指标。仔细研究生长速率和载流子浓度对距150 mm晶圆中心的径向距离的依赖性,发现实际C / Si比刚好高于晶圆:表面C / ​​Si比,与引入的C / Si完全不同。硅比率。外延膜的厚度和载流子浓度在晶圆内的分布可以通过表面C / ​​Si比来解释,这表明表面C / ​​Si比可能是精确控制大直径晶圆上均匀生长的有用指标。 。还发现,通过控制整个表面的C / Si比,可以生长出两种类型的SiC膜,一种具有极低的缺陷密度,而另一种具有低的凹坑密度,它们具有均一的生长速率和高的载流子浓度。晶圆。 (C)2019日本应用物理学会

著录项

  • 来源
    《Japanese journal of applied physics》 |2019年第sb期|SBBK06.1-SBBK06.6|共6页
  • 作者单位

    NuFlare Technol Inc, TFW Equipment Engn Dept, Yokohama, Kanagawa 2358522, Japan;

    NuFlare Technol Inc, TFW Equipment Engn Dept, Yokohama, Kanagawa 2358522, Japan;

    NuFlare Technol Inc, TFW Equipment Engn Dept, Yokohama, Kanagawa 2358522, Japan;

  • 收录信息
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号