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首页> 外文期刊>Journal of Applied Physics >Synchrotron measurement of the effect of linewidth scaling on stress in advanced Cu/Low-k interconnects
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Synchrotron measurement of the effect of linewidth scaling on stress in advanced Cu/Low-k interconnects

机译：同步加速器测量线宽缩放对高级Cu / Low-k互连中应力的影响

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摘要

The stress of Cu/low-k interconnects with linewidths scaled to 50 nm was determined using precision lattice parameter measurement at an advanced light facility. Grazing incidence and θ-2θ diffraction geometries were used to gain a direct measurement of the strain tensor, showing an increase in stress as the linewidth is reduced an order of magnitude from 500 to 50 nm. This increase in stress contrasts existing predictions of finite element simulations, which predict a decrease in stress as the line aspect ratio increases above one. Our simulations, considering the low-k stack, have shown this decrease should occur at lower aspect ratios; however, neither trend is reflected in the measured data. All of the lines showed a strong [111] texture suggesting their stiffness was not affected at the scaled dimensions. The narrower lines show a more bamboolike structure compared to a more polycrystalline structure in the wider lines. In the narrow lines, the grains become pinned in the linewidth reducing stress relaxation through grain growth or reorder. This leads to the observed increase in stress with linewidth scaling and the increase in stress for bamboo lines during fabrication. This work demonstrates the grain structure of interconnects has a significant effect on stress and stress evolution.
机译：使用先进的照明设备，通过精确的晶格参数测量来确定线宽定为50 nm的Cu / low-k互连的应力。掠入射和θ-2θ衍射几何形状用于直接测量应变张量，显示的应力随着线宽从500 nm减小到50 nm数量级而增加。应力的增加与有限元模拟的现有预测形成对比，有限元模拟的预测随着线宽比增加到大于1时应力减小。考虑到低k堆栈，我们的仿真表明，这种降低应该在较低的宽高比下发生。但是，趋势均未反映在测量数据中。所有线条都显示出很强的[111]质感，表明它们的刚度在缩放尺寸时不受影响。与较宽的线条中的多晶结构相比，较窄的线条显示出更像竹子的结构。在细线中，晶粒固定在线宽上，从而减少了由于晶粒生长或重新排列而引起的应力松弛。这导致观察到的应力随着线宽比例的增加而增加，并且导致竹线在制造过程中的应力增加。这项工作表明互连的晶粒结构对应力和应力演化具有显着影响。

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  • 来源
    《Journal of Applied Physics》 |2009年第5期|053524.1-053524.7|共7页
  • 作者

    Christopher J. Wilson; Kristof Croes; Chao Zhao; Till H. Metzger; Larry Zhao; Gerald P. Beyer; Alton B. Horsfall; Anthony G. ONeill; Zsolt Toekei;

  • 作者单位

    School of Electrical, Electronic, and Computer Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, United Kingdom IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

    European Synchrotron Radiation Facility, BP 220, 38043 Grenoble Cedex, France;

    Intel Corp. Industrial Resident, IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

    School of Electrical, Electronic, and Computer Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, United Kingdom;

    School of Electrical, Electronic, and Computer Engineering, Newcastle University, Newcastle upon Tyne NE1 7RU, United Kingdom;

    IMEC, Kapeldreef 75, B-3001 Leuven, Belgium;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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