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首页> 外文期刊>Journal of Crystal Growth >Uniformity of 4H-SiC epitaxial layers grown on 3-in diameter substrates
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Uniformity of 4H-SiC epitaxial layers grown on 3-in diameter substrates

机译:在直径3英寸的衬底上生长的4H-SiC外延层的均匀性

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摘要

Uniformity of thickness and carrier concentration of homo-epitaxial films grown on 3-in diameter 4H-SiC substrates using a horizontal hot-wall reactor has been investigated. From the comparison between the experimental results and temperature and gas flow simulation, it is found that the thickness (growth rate) distribution is closely related to the gas velocity distribution, and the carrier concentration distribution has strong correlation with the temperature distribution not on the surface of the susceptor plate but in the gas phase. It is pointed out that the growth rate uniformity of 3-in diameter wafer is degraded by the gas flow disturbance near the susceptor's side walls, and the carrier concentration uniformity is strongly related to the gas phase reaction of nitrogen containing species, such as N_2 and/or others.
机译:研究了使用水平热壁反应器在3英寸直径4H-SiC衬底上生长的同质外延膜的厚度和载流子浓度的均匀性。从实验结果与温度和气流模拟的比较中发现,厚度(生长速率)分布与气体速度分布密切相关,并且载流子浓度分布与不在表面的温度分布有很强的相关性。基座板的一部分,但处于气相状态。要指出的是,直径3的晶片的生长速率均匀性会因基座侧壁附近的气流扰动而降低,并且载流子浓度的均匀性与诸如N_2和N_2的含氮物质的气相反应密切相关。 /或其他。

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