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首页> 外文期刊>Journal of Electronic Materials >Thermoelectric Properties as a Function of Electronic Band Structure and Microstructure of Textured Materials
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Thermoelectric Properties as a Function of Electronic Band Structure and Microstructure of Textured Materials

机译：热电性能随织构材料电子能带结构和微结构的变化

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摘要

A tool has been developed at Fraunhofer-IPM to calculate the transport properties of thermoelectric material by using its band structure described in terms of effective masses and the location of the ellipsoids in reciprocal space. The calculated transport properties are compared with experimental data measured on bismuth telluride, antimony telluride, and bismuth antimony telluride. Polycrystalline specimens have been prepared by spark plasma sintering (Fraunhofer-IFAM). Electron backscattering diffraction analysis of sample cross-sections yields the frequency distribution of grain orientations. This texture information permits the generation of appropriate finite-element models of the polycrystalline microstructure (TU Dresden). By means of the commercial code COMSOL, which allows anisotropic thermoelectric properties to be taken into account, the effective electrical and thermal conductivities as well as the Seebeck coefficient both parallel and perpendicular to the pressing direction have been calculated.
机译：Fraunhofer-IPM公司开发了一种工具，通过使用根据有效质量和椭圆形在倒数空间中的位置描述的能带结构来计算热电材料的传输特性。将计算出的传输性能与在碲化铋，碲化锑和碲化铋锑上测得的实验数据进行比较。已经通过火花等离子体烧结（Fraunhofer-IFAM）制备了多晶试样。样品横截面的电子反向散射衍射分析可得出晶粒取向的频率分布。该纹理信息允许生成多晶微结构（TU Dresden）的合适的有限元模型。通过商业代码COMSOL，它可以考虑各向异性的热电特性，计算出了平行于和垂直于压制方向的有效电导率和热导率以及塞贝克系数。

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