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首页> 外文期刊>Journal of Electronic Packaging >Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management
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Evolution of Hardware Morphology of Large-Scale Computers and the Trend of Space Allocation for Thermal Management

机译：大型计算机硬件形态的演变以及热管理空间分配的趋势

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Thermal management of very large-scale computers will have to leave the traditional well-beaten path. Up to the present time, the primary concern has been with rising heat flux on the integrated circuit chip, while a space has been available for the implementation of high-performance cooling design. In future systems, the spatial constraint will become a primary determinant of thermal management methodology. To corroborate this perspective, the evolution of computer's hardware morphology is simulated. Simulation tool is the geometric model, where the model structure is composed of circuit cells and platforms for circuit blocks. The cell is the minimum circuit element whose size is pegged to the technology node, while the total number of cells represents the system size. The platforms are the models of microprocessor chips, multichip modules (MCMs), and printed wiring boards (PWBs). The major points of discussion are as follows: (1) The system morphology is dictated by the competition between the progress of technology node and the demand for increase in the system size. (2) Only where the miniaturization of cells is achieved so as to deploy a system on a few PWBs, ample space is created for thermal management. (3) In the future, the cell miniaturization will hit the physical limit, while the demand for larger systems will be unabated. Liquid cooling, where the coolant is driven through very long microchannels, may provide a viable thermal solution.
机译：大型计算机的热管理将不得不走出传统的老路。到目前为止，主要的关注点是集成电路芯片上的热通量不断增加，同时还为实现高性能冷却设计提供了空间。在未来的系统中，空间约束将成为热管理方法的主要决定因素。为了证实这一观点，模拟了计算机硬件形态的演变。仿真工具是几何模型，其中的模型结构由电路单元和电路块平台组成。单元是最小的电路元件，其大小与技术节点挂钩，而单元的总数代表系统的大小。该平台是微处理器芯片，多芯片模块（MCM）和印刷线路板（PWB）的模型。讨论的主要内容如下：（1）系统形态是由技术节点的进步与系统规模的增长需求之间的竞争所决定的。 （2）仅在实现单元小型化以便在几个PWB上部署系统的地方，才会为热管理创造足够的空间。 （3）将来，单元小型化将达到物理极限，而对大型系统的需求将保持不变。冷却液通过非常长的微通道驱动的液体冷却可以提供可行的散热解决方案。

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