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首页> 外文期刊>Journal of Electronic Packaging >Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection. Influence of the Adhesive Paste on the Junction Temperature
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Embarked Quad Flat Nonlead 16, 32, and 64 Electronic Devices Subjected to Free Convection. Influence of the Adhesive Paste on the Junction Temperature

机译：进行自由对流的上乘四方扁平无铅16、32和64电子设备。胶浆对结温的影响

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摘要

The junction temperature of the quad flat nonlead (QFN) electronic devices equipping embarked assemblies may be controlled so that it does not exceed the maximum value recommended by the manufacturer. The packaging design is then important to ensure correct operation and high reliability, given the significant power generated during operation and the inclination angle of the packages during the flight. It is particularly important when thermoregulation is achieved by means of natural convection. The objective of this study is to examine the influence of the adhesive paste used to connect the Die of the QFN with its base. The study deals with three devices among the most used in the conventional arrangements: the QFN16, 32, and 64. A three-dimensional (3D) numerical solution based on the control volume formulation allows to determine their thermal behavior for generated power ranging from 0.1 to 1.0 W by steps of 0.1 W and inclination angle varying between 0 deg (horizontal position) and 90 deg (vertical position) by steps of 15 deg. A wide range of the paste's thermal conductivity has been considered, varying between '80% and +100% of its average value, measured by means of the transient plane source (TPS) method. The numerical results confirmed by measurements show that the junction temperature strongly increases when the conductivity of the paste decreases. The temperature is moderately reduced when the paste is thermally more conductive. Relationships are proposed to calculate the junction temperature for the three considered devices, according to the generated power, the inclination angle, and the relative paste's thermal conductivity.
机译：可以对配备有登机组件的四方扁平无铅（QFN）电子设备的结温进行控制，以使其不超过制造商建议的最大值。鉴于在运行过程中产生的大量功率以及飞行过程中包装的倾斜角度，包装设计对于确保正确的操作和高可靠性非常重要。当通过自然对流实现温度调节时，这一点尤其重要。这项研究的目的是研究用于将QFN的管芯与其基座连接的粘合剂的影响。该研究涉及常规布置中最常用的三种设备：QFN16、32和64。基于控制体积公式的三维（3D）数值解可确定其热行为，以产生的功率范围为0.1以0.1 W为步长至1.0 W，倾斜角度在0度（水平位置）到90度（垂直位置）之间以15度为步长变化。通过瞬态平面源（TPS）方法测得的糊料导热系数范围很广，介于平均值的80％到+ 100％之间。通过测量证实的数值结果表明，当糊剂的电导率降低时，结温会大大提高。当糊的导热性更高时，温度会适度降低。根据所产生的功率，倾斜角度和相对糊剂的热导率，提出了关系式来计算三种考虑的器件的结温。

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  • 来源
    《Journal of Electronic Packaging》 |2017年第4期|041009.1-041009.5|共5页
  • 作者

    Baïri Abderrahmane; Chanetz Bruno P.G.; Millán-García José Antonio;

  • 作者单位

    University of Paris, Laboratoire Thermique Interfaces Environnement, LTIE-GTE EA 4415, 50, rue de Sèvres, Ville d'Avray, France,Association Aéronautique et Astronautique de France, 6, rue Galilée, Paris, France;

    Association Aéronautique et Astronautique de France, 6, rue Galilée, Paris, France,Office National d'Etudes et de Recherches Aérospatiales (ONERA), Chemin de la Hunière, BP 80100, Palaiseau Cedex, France;

    UPV/EHU, Departamento Máquinas y Motores Térmicos, University of the Basque Country, Escuela de Ingeniería de Gipuzkoa, ENEDI Research Group, Plaza Europa 1, San Sebastián-Donostia, Spain;

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