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首页> 外文期刊>Journal of Electronic Packaging >Determination of Energy Release Rate Through Sequential Crack Extension
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Determination of Energy Release Rate Through Sequential Crack Extension

机译：通过顺序裂纹扩展确定能量释放率

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摘要

A method to determine the critical energy release rate of a peel tested sample using an energy-based approach within a finite element framework is developed. The method uses a single finite element model, in which the external work, elastic strain energy, and inelastic strain energy are calculated as nodes along the crack interface are sequentially decoupled. The energy release rate is calculated from the conservation of energy. By using a direct, energy-based approach, the method can account for large plastic strains and unloading, both of which are common in peel tests. The energy rates are found to be mesh dependent; mesh and convergence strategies are developed to determine the critical energy release rate. An example of the model is given in which the critical energy release rate of a 10-μm thick electroplated copper thin film bonded to a borosilicate glass substrate which exhibited a 3.0 N/cm average peel force was determined to be 20.9 J/m~2.
机译：开发了一种在有限元框架内使用基于能量的方法确定剥离测试样品的临界能量释放速率的方法。该方法使用单个有限元模型，其中当沿裂纹界面的节点顺序解耦时，将计算外部功，弹性应变能和非弹性应变能。能量释放率由能量守恒计算得出。通过使用基于能量的直接方法，该方法可以解决较大的塑性应变和卸载问题，这在剥离测试中很常见。发现能量速率取决于网格。开发了网格和收敛策略来确定临界能量释放速率。给出模型的示例，其中将粘结到表现出3.0 N / cm平均剥离力的硼硅酸盐玻璃基板的10μm厚电镀铜薄膜的临界能量释放速率确定为20.9 J / m〜2 。

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  • 来源
    《Journal of Electronic Packaging》 |2017年第4期|041003.1-041003.9|共9页
  • 作者

    McCann Scott R.; Ostrowicki Gregory T.; Tran Anh V.; Huang Timothy; Bernhard Tobias; Tummala Rao; Sitaraman Suresh K.;

  • 作者单位

    George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States;

    George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States;

    George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States;

    3D Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    Atotech Deutschland GmbH, Berlin, Germany;

    3D Packaging Research Center, Georgia Institute of Technology, Atlanta, GA, United States;

    George W. Woodruff School of Mechanical Engineering, Georgia Institute of Technology, Atlanta, GA, United States;

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