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首页> 外文期刊>Journal of Electronic Packaging >Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements
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Correlating Drop Impact Simulations With Drop Impact Testing Using High-Speed Camera Measurements

机译：使用高速相机测量将跌落冲击模拟与跌落冲击测试相关联

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摘要

The increased use of mobile appliances such as mobile phones and navigation systems in today's society has resulted in an increase in reliability issues related to drop performance. Mobile appliances are dropped several times during their lifespan and the product is required to survive common drop accidents. A widely accepted method to assess the drop reliability of microelectronics on board-level is the drop impact test. This test has been standardized by international councils such as Joint Electron Device Engineering Council and is widely adopted throughout the industry. In this research the solder loading is investigated by combining high-speed camera measurements of several drop impact tests with verified finite element models. These simulation models are developed in order to gain an insight on the loading pattern of solder joints based on interconnect layout, drop conditions, and product specifications prior to physical prototyping. Deflections and frequencies during drop testing are measured using a high-speed camera setup. The high-speed camera experiments are performed on two levels: machine level (rebounds with and without a catcher) and product level (with different levels of energy and different pulse times). Parametric (dynamic and quasistatic) 3D models are developed to predict the drop impact performance. The experimental results are used to verify and enhance the simulation models, e.g., by tuning the damping parameters. As a result, the verified models can be used to determine the location of the critical solder joint and to obtain estimates of the solder lifetime performance.
机译：在当今社会，越来越多地使用诸如移动电话和导航系统之类的移动设备，导致与下降性能有关的可靠性问题增加。移动设备在其使用寿命中会掉落几次，因此该产品必须能够承受常见的掉落事故。评估板级微电子器件跌落可靠性的一种广泛接受的方法是跌落冲击测试。该测试已由国际委员会（例如，联合电子设备工程委员会）标准化，并在整个行业中被广泛采用。在这项研究中，通过将多个跌落冲击测试的高速相机测量结果与经过验证的有限元模型相结合，来研究焊料负载量。开发这些仿真模型是为了在物理原型制作之前基于互连布局，掉落条件和产品规格来了解焊点的加载模式。跌落测试期间的变形和频率是使用高速相机设置测量的。高速相机实验在两个级别上执行：机器级别（带和不带有捕手的回弹）和产品级别（具有不同的能量级别和不同的脉冲时间）。开发了参数（动态和准静态）3D模型来预测跌落冲击性能。实验结果用于例如通过调整阻尼参数来验证和增强仿真模型。结果，经过验证的模型可用于确定关键焊点的位置并获得对焊锡寿命性能的估计。

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