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首页> 外文期刊>Journal of Electronic Packaging >Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications
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Merits of Employing Foam Encapsulated Phase Change Materials for Pulsed Power Electronics Cooling Applications

机译：在脉冲电力电子冷却应用中采用泡沫密封相变材料的优点

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摘要

In the present work, the potential of using foam structures impregnated with phase change materials (PCMs) as heat sinks for cooling of electronic devices has been numerically studied. Different design parameters have been investigated such as foam properties (porosity, pore size, and thermal conductivity), heat sink shape, orientation, and use of internal fins inside the foam-PCM composite. Due to huge difference in thermal properties between the PCM and the solid matrix, two energy equation model has been adopted to solve the energy conservation equations. This model can handle local thermal nonequilibrium condition between the PCM and the solid matrix. The numerical model is based on volume averaging technique, and the finite volume method is used to discretize the heat diffusion equation. The findings show that, for steady heat generation, the shape and orientation of the composite heat sink have significant impact on the system performance. Conversely, in the case of power spike input, use of a PCM with low melting point and high latent heat is more efficient.
机译：在当前的工作中，已对使用浸渍有相变材料（PCM）的泡沫结构作为散热器冷却电子设备的潜力进行了数值研究。已经研究了不同的设计参数，例如泡沫特性（孔隙度，孔径和导热率），散热器形状，方向以及泡沫-PCM复合材料内部内部散热片的使用。由于PCM和固体基质之间的热性质差异很大，因此采用了两个能量方程模型来求解能量守恒方程。该模型可以处理PCM和固体基质之间的局部热不平衡条件。数值模型基于体积平均技术，并使用有限体积法离散热扩散方程。研究结果表明，对于稳定的热量产生而言，复合散热器的形状和方向对系统性能有重大影响。相反，在功率尖峰输入的情况下，使用低熔点和高潜热的PCM更为有效。

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