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首页> 外文期刊>Journal of Electronic Packaging >Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions
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Investigation of Conductive Adhesive Bonding Using UV Curable Anisotropic Conductive Adhesives at Different Curing Conditions

机译：在不同固化条件下使用UV固化各向异性导电胶进行导电胶粘接的研究

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摘要

Generally, adhesive materials can be cured in a short time under high curing temperature. High curing temperature usually leads to an increase in cross-link density and a homologous increase in heat resistance. Nevertheless, curing process under high temperature problems can occur such as the inclination for the adhesive materials to shrinkage, cracks, voids and it would probably lower the dielectric properties. UV curing of anisotropic conductive adhesives (ACAs) offers several advantages over the conventional epoxy resin, including rapid cure, little to no emission of volatile organic compounds and without affecting other components in the assembly [Pataki, W. S., 1997, "Optimization of Free-Radical Initiation Reactions in the Electrical Industry," Electrical Insulation Conference and Electrical Manufacturing and Coil Winding Conference Proceedings, pp. 745-751]. Based on the aforementioned advantages, it is worth investigating the bonding properties at different curing conditions. In this work, a new type of UV curable ACA for chip-on-flex application is presented. The adhesive bonds of the chip-on-flex application are cured at different cure cycles within a range of UV frequencies. Cure cycles in this work were the different periods of time that were needed to cure the ACAs under different UV light intensities. Fourier transform infrared spectroscopy with attenuated total internal reflection was used to investigate the curing degree of the ACAs at different cure cycles. The result shows that the longer the curing time and the larger the UV intensity, the higher the curing degree can be obtained. Furthermore, the curing time in the UV curable ACA was much shorter than that of the conventional thermal curable ACAs. Shear test was done to find out the shear strength of the bonding. Finally, after shear test, scanning electron microscope was used to investigate the fracture mode of the chip-on-flex application at different curing cycles.
机译：通常，粘合剂材料可以在高固化温度下在短时间内固化。较高的固化温度通常会导致交联密度的增加和耐热性的同源性增加。然而，在高温下的固化过程可能会发生，例如粘合剂材料倾向于收缩，破裂，空洞，并且可能会降低介电性能。与常规环氧树脂相比，各向异性导电胶粘剂（ACA）的UV固化具有多个优点，包括快速固化，极少或几乎没有挥发性有机化合物的散发，并且不影响组件中的其他组件[Pataki，WS，1997，“ Free-Optimization of Free-电气工业中的自由基引发反应”，《电气绝缘会议和电气制造与线圈绕制会议论文集》，第745-751页。基于上述优点，值得研究不同固化条件下的粘结性能。在这项工作中，提出了一种适用于柔性芯片上应用的新型紫外线固化ACA。柔性上芯片应用的粘合剂在紫外线频率范围内以不同的固化周期固化。这项工作的固化周期是在不同的紫外线强度下固化ACA所需的不同时间段。使用傅里叶变换红外光谱（具有衰减的全内反射）来研究ACA在不同固化周期下的固化程度。结果表明，固化时间越长，紫外线强度越大，固化度越高。此外，UV可固化ACA中的固化时间比常规热可固化ACA中的固化时间短得多。进行了剪切测试以发现粘结的剪切强度。最后，在剪切测试之后，使用扫描电子显微镜研究柔性固化芯片在不同固化周期下的断裂模式。

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