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首页> 外文期刊>Journal of Electronic Testing >Substrate Testing on a Multi-Site/Multi-Probe ATE
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Substrate Testing on a Multi-Site/Multi-Probe ATE

机译：在多站点/多探针ATE上进行基板测试

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摘要

This paper presents a novel method that utilizes multi-site and multi-probe capabilities of an ATE for testing of pre-assembly MCM substrates. Testing multiple SUTs (substrates under test) simultaneously can improve the efficiency of the probes in an ATE and considerably reduce the total test time. An analytical model that predicts very accurately the testing time of a SUT batch is proposed. Based on this model, the optimal multi-site testing configuration as corresponding to the batch size can be established. Simulation results for an ATE with 12 flying-probes as an example of a commercially available tester are provided; for this ATE the proposed method achieves a reduction of 54.66% in test time over a single-site method (both at complete coverage of the modeled faults).
机译：本文介绍了一种新颖的方法，该方法利用ATE的多站点和多探针功能来测试预组装MCM基板。同时测试多个SUT（被测基板）可以提高ATE中探针的效率，并显着减少总测试时间。提出了一种非常准确地预测SUT批次测试时间的分析模型。基于此模型，可以建立与批次大小相对应的最佳多站点测试配置。提供了带有12个飞行探针的ATE的仿真结果，以市售测试仪为例。对于此ATE，所提出的方法比单站点方法（在完全覆盖建模故障的情况下）的测试时间减少了54.66％。

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