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A Solvent Extraction Approach To Recover Acetic Acid From Mixed Waste Acids Produced During Semiconductor Wafer Process

机译:一种从半导体晶圆工艺过程中产生的混合废酸中回收乙酸的溶剂萃取方法

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Recovery of acetic acid (HAc) from the waste etching solution discharged from silicon wafer manufacturing process has been attempted by using solvent extraction process. For this purpose 2-ethylhexyl alcohol (EHA) was used as organic solvent. In the pre-treatment stage >99% silicon and hydrofluoric acid was removed from the solution by precipitation. The synthesized product, Na_2SiF_6 having 98.2% purity was considered of commercial grade having good market value. The waste solution containing 279g/L acetic acid, 513 g/L nitric acid, 0.9 g/L hydrofluoric acid and 0.030 g/L silicon was used for solvent extraction study. From the batch test results equilibrium conditions for HAc recovery were optimized and found to be 4 stages of extraction at an organic:aqueous (O: A) ratio of 3, 4 stages of scrubbing and 4 stages of stripping at an O:A ratio of 1. Deionized water (DW) was used as stripping agent to elute HAc from organic phase. In the whole batch process 96.3% acetic acid recovery was achieved. Continuous operations were successfully conducted for 100 h using a mixer-settler to examine the feasibility of the extraction system for its possible commercial application. Finally, a complete process flowsheet with material balance for the separation and recovery of HAc has been proposed.
机译:已经尝试通过使用溶剂提取工艺从硅晶片制造工艺中排出的废蚀刻溶液中回收乙酸(HAc)。为此,将2-乙基己醇(EHA)用作有机溶剂。在预处理阶段,通过沉淀从溶液中去除了> 99%的硅和氢氟酸。具有98.2%纯度的合成产物Na_2SiF_6被认为是具有良好市场价值的商业级。含有279 g / L乙酸,513 g / L硝酸,0.9 g / L氢氟酸和0.030 g / L硅的废液用于溶剂萃取研究。从分批测试结果中可以优化HAc回收的平衡条件,发现在有机:水(O:A)为3的条件下,萃取为4个阶段,在O:A为0的条件下,洗涤为4个阶段,汽提为4个阶段。 1.用去离子水(DW)作为汽提剂从有机相中洗脱HAc。在整个分批过程中,乙酸回收率达到96.3%。使用混合沉降器成功进行了连续操作100小时,以检查萃取系统在其可能的商业应用中的可行性。最后,提出了具有物料平衡的完整工艺流程图,用于HAc的分离和回收。

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