Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

Tomas Moreno-Torres; Daniel Lorenzini; Yogendra Joshi; Abel Hernandez-Guerrero; J. Luis Luviano-Ortiz

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Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

机译：推测统计方法参数分析三维堆叠硅微电子微流体冷却系统

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This work is a numerical study of microfluidic cooling of integrated circuits (ICs), using embedded micropin-fins on a silicon chip. The study considers non-uniform chip heat fluxes (250-500 W/cm~2) and variable pin fin density using DI water as coolant. A parametric analysis was performed, using the theory of design of experiments (DoE) in order to find the best performing configurations. The proposed factorial design considers six geometrical parameters resulting in 64 microfluidic cooling configurations. The pressure drop and average chip temperatures were obtained for each model to determine the importance of input parameters utilizing a statistical approach. Results from this optimization point to different suitable configurations in which the maximum device temperature is below 60°C, under moderate pressure drops below 80 kPa. This work takes advantage of numerical models and statistical approaches to seek optimal designs of microfluidic cooling systems and to identify key parameters that have influence on their global performance. In addition, alternative configurations are also assessed for cases in which thermal or hydraulic parameters could be traded-off depending on the application. The results from this study are helpful for the design of chip thermal management with nonuniform power distribution.

机译：这项工作是在硅芯片上使用嵌入的微量翅片的集成电路（IC）微流体冷却的数值研究。该研究考虑使用DI水作为冷却剂的不均匀芯片热通量（250-500W / cm〜2）和可变销鳍密度。使用实验设计理论（DOE）进行参数分析，以找到最佳的执行配置。所提出的因子设计考虑了六个几何参数，导致64个微流体冷却配置。为每个模型获得压降和平均芯片温度，以确定利用统计方法的输入参数的重要性。通过该优化点对不同合适的配置，其中最大装置温度低于60℃，在低于80kPa以下的中等压力下降。这项工作利用了数字模型和统计方法寻求最佳设计的微流体冷却系统，并识别对其全球性能影响的关键参数。此外，还评估了替代配置，以便根据应用程序进行热量或液压参数的情况进行评估。本研究的结果有助于使用非均匀电力分布设计芯片热管理。

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来源
《Journal of Heat Transfer》 |2021年第4期|044502.1-044502.9|共9页
作者
Tomas Moreno-Torres; Daniel Lorenzini; Yogendra Joshi; Abel Hernandez-Guerrero; J. Luis Luviano-Ortiz;
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作者单位

Department of Mechanical Engineering University of Guanajuato Salamanca Gto 36500 Mexico;

G.W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA 30332;

G.W. Woodruff School of Mechanical Engineering Georgia Institute of Technology Atlanta GA 30332;

Department of Mechanical Engineering University of Guanajuato Salamanca Gto 36500 Mexico;

Department of Mechanical Engineering University of Guanajuato Salamanca Gto 36500 Mexico;

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收录信息美国《科学引文索引》(SCI);美国《工程索引》(EI);
原文格式 PDF
正文语种 eng
中图分类
关键词
microfluidic cooling; three-dimensional integrated circuits; silicon microgap; silicon microchannel; design of experiments analysis;

机译：微流体冷却;三维集成电路;硅片微胶;硅微通道;实验分析设计;

Parametric Analysis of Microfluidic Cooling Systems for Three-Dimensional-Stacked Silicon Microelectronics by Inferential Statistic Approaches

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