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首页> 外文期刊>Journal of Heat Transfer >Hierarchical Superhydrophobic Copper for Sustained Dropwise Condensation
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Hierarchical Superhydrophobic Copper for Sustained Dropwise Condensation

机译：分层超疏水铜用于持续的液滴冷凝

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摘要

Engineering surfaces that sustain continuous dropwise condensation, and are composed of materials commonly employed in heat transfer applications, are of great interest for scaled-up industrial systems. We fabricate hierarchical microano-structured superhydrophobic surfaces on copper substrates. Condensate droplet growth dynamics on the as-fabricated samples were investigated using an environmental scanning electron microscope (ESEM; FEI Quanta 3D, ～6 torr, ～3 ℃ stage). Time-lapse ESEM images show that the condensate droplets preferentially nucleate at the bases of the hill-shaped microstructures (40 s). The droplets at the microstructure bases coalesce; merged droplets rise and appear to be suspended atop adjacent microstructures (180-220 s). These droplets, when triggered by coalescence, can gain sufficient kinetic energy by a reduction in droplet surface area/energy to spontaneously depart from the substrate. This droplet motion sweeps additional droplets in the trajectory and exposes fresh space for formation of new droplets (220-250 s). These droplet growth and departure dynamics are facilitated by the combination of microscale and nanoscale roughness features on the surface, and the behavior provides important insight into surface design requirements for sustaining dropwise condensation in thermal management applications.
机译：维持连续滴状凝结并且由传热应用中常用的材料组成的工程表面对于规模化工业系统非常感兴趣。我们在铜基板上制造分层的微/纳米结构超疏水表面。使用环境扫描电子显微镜（ESEM； FEI Quanta 3D，〜6 torr，〜3℃阶段）研究了加工后样品上的冷凝液滴生长动力学。随时间推移的ESEM图像显示，凝结水滴优先在山形微结构的底部成核（40 s）。微结构基部的液滴聚结；合并的液滴上升并似乎悬浮在相邻的微结构上方（180-220 s）。当通过聚结触发时，这些液滴可通过减小液滴表面积/能量以自发离开基底而获得足够的动能。这种液滴运动扫掠了轨迹中的其他液滴，并为形成新的液滴（220-250 s）暴露了新的空间。表面上的微米级和纳米级粗糙度特征的组合促进了这些液滴的生长和偏离动力学，并且该行为为在热管理应用中维持液滴凝结的表面设计要求提供了重要的见识。

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  • 来源
    《Journal of Heat Transfer》 |2015年第8期|080904.1-080904.1|共1页
  • 作者

    Xuemei Chen; Justin A. Weibel; Suresh V. Garimella;

  • 作者单位

    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088 USA;

    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088 USA;

    School of Mechanical Engineering, Purdue University, West Lafayette, IN 47907-2088 USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
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