We take immense pleasure in taking out a special issue on recent works on high heat flux cooling of electronics. Research on high heat flux electronic cooling has gathered momentum and has been developed as a highly specialized study in the traditional as well as new and emerging areas in the field of thermal science and engineering. Papers on cutting edge research in the field of high heat flux electronic cooling have been submitted. In all, 27 papers were submitted. All the papers had undergone the stringent review process of ASME Journal of Heat Transfer standard. Finally, out of these 27 manuscripts, only 17 papers have been accepted for publication. Accepted papers exemplify the best ideas deserving archival publication in Journal of Heat Transfer.
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机译：我们非常高兴地就电子产品的高热通量冷却的最新著作发表特刊。关于高热通量电子冷却的研究势头强劲，并且已经发展成为热科学和工程领域的传统领域以及新兴领域中的高度专业化研究。已经提交了有关高热通量电子冷却领域前沿研究的论文。总共提交了27篇论文。所有论文均经过了ASME Journal of Heat Transfer标准的严格审查。最后，在这27份手稿中，只有17篇论文被接受发表。被接受的论文体现了最佳的想法，值得在热传递杂志上存档。
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