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首页> 外文期刊>Journal of Heat Transfer >Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance
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Analytical Thermal Solution to a Nonuniformly Powered Stack Package With Contact Resistance

机译：具有接触电阻的非均匀功率堆栈封装的解析热解决方案

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摘要

The semiconductor industry, following Moore's law, has consistently followed a trajectory of miniaturization that enables design engineers to achieve greater levels of innovation in the same or smaller die footprints. According to Samsung technologists, the next generation of semiconductor technology will cost about $10 billion to create. Alternatively, improved performance through lowering of signal delays can also be achieved using stacked or 3D packaging. With this architectural achievement come cooling challenges as it is difficult to utilize conventional cooling technology and especially when stacking logic and memory processors for high end applications. The accumulation of excessive heat within the stack is a challenge that has caused thermal engineers to focus on the issue of extracting this heat from the system. Thus, one important aspect of design is the ability to obtain an accurate analytical temperature solution of the multilayer stack packages beforehand in order to sustain the reliability of the 3D stack packages albeit for a more simplified configuration. This study addresses the analytical solution of temperature distribution in multilayer bodies by using the Mathematica code developed in this study. The numerical approach using ansys Workbench is discussed, and the results are compared with the one obtained analytically.
机译：遵循摩尔定律的半导体行业始终遵循微型化的轨迹，这使设计工程师能够在相同或较小的管芯占位面积上实现更高水平的创新。据三星技术人员称，下一代半导体技术的制造成本约为100亿美元。或者，也可以使用堆叠或3D封装来降低信号延迟，从而提高性能。凭借这一架构成就，冷却挑战变得尤为突出，因为难以利用传统的冷却技术，尤其是在为高端应用堆叠逻辑和存储处理器时。堆中过多热量的积累是一个挑战，已导致热工程师专注于从系统中提取热量的问题。因此，设计的一个重要方面是能够预先获得多层堆叠封装的精确分析温度解决方案的能力，以维持3D堆叠封装的可靠性，尽管其配置更为简化。本研究使用本研究开发的Mathematica代码解决了多层体内温度分布的解析解。讨论了使用ansys Workbench进行数值计算的方法，并将结果与​​通过解析获得的结果进行比较。

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  • 来源
    《Journal of Heat Transfer》 |2013年第11期|111015.1-111015.9|共9页
  • 作者

    S. Ghalambor; D. Agonafer; A. Haji-Sheikh;

  • 作者单位

    Department of Mechanical and Aerospace Engineering, The University of Texas at Arlington, Arlington, TX 76019-0018;

    Department of Mechanical and Aerospace Engineering, The University of Texas at Arlington, Arlington, TX 76019-0018;

    Department of Mechanical and Aerospace Engineering, The University of Texas at Arlington, Arlington, TX 76019-0018;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    conduction; electronic cooling; heat transfer; 3D stacks; contact resistance;

    机译：传导电子冷却;传播热量;3D堆栈;接触电阻;

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