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首页> 外文期刊>Journal of Heat Transfer >Enhancement of Saturation Boiling of PF-5060 on Microporous Copper Dendrite Surfaces
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Enhancement of Saturation Boiling of PF-5060 on Microporous Copper Dendrite Surfaces

机译:PF-5060在微孔铜枝晶表面上饱和沸腾的增强

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摘要

Experiments are performed to investigate saturation boiling of degassed PF-5060 dielectric liquid on microporous copper dendrite surface layers deposited on 10 ×10 mm~2 Cu substrates. The electrochemically deposited surface layers are of different thicknesses (145.6 μm, 46.3 μm, and 33.1 μm). The thickest layer gives the best results: the saturation CHF of 25.27 W/cm~2 occurs at a surface superheat of only 2.9 K and the maximum nucleate boiling heat transfer coefficient, h_(MNB), near the end of the fully developed nucleate boiling region, is 8.76 W/cm~2 K. In addition, nucleate boiling ensues at a surface temperature slightly above saturation (<0.5 K), with no temperature excursion. The temperature excursions before initiating boiling on the 46.3 μm and 33.1 μm thick Cu nanodendrite surface layers are small (3.7 K and 6 K), corresponding to surface temperatures of ~55.1 ℃ and 57.4℃, respectively. These temperatures are much lower than recommended (85℃) for reliable operation of most silicon electronics and central processor units.
机译:进行了实验,以研究脱气的PF-5060电介质液体在沉积在10×10 mm〜2 Cu衬底上的微孔铜枝晶表面层上的饱和沸腾。电化学沉积的表面层具有不同的厚度(145.6μm,46.3μm和33.1μm)。最厚的层可获得最佳结果:在表面过热仅2.9 K时,饱和CHF达到25.27 W / cm〜2,并且在充分发展的核沸腾即将结束时,最大的核沸腾传热系数h_(MNB)该区域的温度为8.76 W / cm〜2K。此外,在表面温度略高于饱和度(<0.5 K)时会发生核沸腾,而没有温度偏移。在46.3μm和33.1μm厚的Cu纳米树枝晶表面层上开始沸腾之前的温度偏移很小(3.7 K和6 K),分别对应于约55.1℃和57.4℃的表面温度。这些温度远低于大多数硅电子设备和中央处理器单元可靠运行所建议的温度(85℃)。

著录项

  • 来源
    《Journal of Heat Transfer》 |2010年第7期|P.071501.1-071501.9|共9页
  • 作者单位

    Department of Chemical and Nuclear Engineering,and Department of Mechanical Engineering,University of New Mexico,Albuquerque, NM 87131 Institute for Space and Nuclear Power Studies (ISNPS),University of New Mexico,Albuquerque, NM 87131;

    rnISNPS,University of New Mexico,Albuquerque, NM 87131 Department of Mechanical Engineering,University of New Mexico,Albuquerque, NM 87131;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    pool boiling enhancement; copper nanodendrites; electrochemical deposition; electronics cooling; dielectric liquids;

    机译:池沸腾增强铜纳米树突;电化学沉积电子冷却介电液体;

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