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Active Thermal Control of Distributed Parameter Systems With Application to Testing of Packaged IC Devices

机译:分布式参数系统的主动热控制及其在封装IC器件测试中的应用

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Active control of the die-level temperature is desirable during production testing of high power microprocessors, so as to ensure accurate performance classification. Such control requires that the controlling thermal load time-lead the dissipated thermal load and that it be modulated to account for the distributed thermal capacitance and resistance of the device packaging. The analysis in this paper demonstrates fundamental limits of temperature control for typical devices under test conditions. These limits are identified for specified control power to die power ratios. The effects of test sequence design and device package design on the temperature control limits are also examined. The theory developed can be applied to any thermal control problem where a conductive medium separates the control source from the location where control is desired.
机译:在大功率微处理器的生产测试期间,需要主动控制芯片级温度,以确保准确的性能分类。这种控制要求控制热负载在时间上领先于耗散的热负载,并且需要对其进行调制以解决器件封装的分布热电容和电阻。本文的分析证明了典型器件在测试条件下的温度控制的基本限制。这些限制是针对指定的控制功率与功率比确定的。还检查了测试程序设计和设备封装设计对温度控制极限的影响。所开发的理论可以应用于任何热控制问题,在这些问题中,导电介质会将控制源与需要控制的位置分开。

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