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首页> 外文期刊>Journal of Imaging Science and Technology >Solder Jet Printhead for Deposition of Molten Metal Drops
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Solder Jet Printhead for Deposition of Molten Metal Drops

机译：喷焊喷头，用于沉积熔融金属滴

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摘要

We have developed a drop-on-demand printhead that can eject molten metal droplets. The capability of ejecting solder drops onto an X- Y stage controlled substrate makes this new technology ideal for fast prototyping of metallic traces on planar and three-dimensional (3D) objects. The ejection process uses the electromagnetic repulsion force between two parallel currents moving in opposite directions. One current path flows through the molten metal, such as solder, the other through a copper stripe. The electrical connection between the two conductors was accomplished by two Ni plated vias. By adding an appropriate nozzle in the solder channel, a current pulse can cause a drop to squirt out. The size of the ejected solder drop depends on the driving energy, which is controlled by both the pulse width and the drive voltage. For successful operation of the printhead, wettability of the solder to the printhead material needs to be taken into consideration. We have constructed the solder jet printhead in both a polyimide laminate stack and a ceramic form that can withstand a much high temperature. We have ejected molten PbSn eutectic solder as well as BiSn and InSn with precision on Si wafers, over substrates with different heights and connecting the traces on different levels, as well as creating freestanding 3D structures.
机译：我们已经开发了按需滴落式打印头，可以喷射熔融金属滴。将焊料滴喷射到X-Y平台控制的基板上的能力使这项新技术非常适合在平面和三维（3D）物体上快速制作金属迹线的原型。弹射过程使用沿相反方向移动的两个平行电流之间的电磁排斥力。一个电流路径流过诸如焊料之类的熔融金属，另一电流流过铜条。两个导体之间的电连接通过两个镀镍的通孔实现。通过在焊料通道中添加合适的喷嘴，电流脉冲会导致液滴喷出。焊锡滴的大小取决于驱动能量，该驱动能量由脉冲宽度和驱动电压共同控制。为了成功运行打印头，需要考虑焊料对打印头材料的润湿性。我们已经以聚酰亚胺层压板叠层和可承受高温的陶瓷形式构造了焊料喷射打印头。我们已经将熔融的PbSn共晶焊料以及BiSn和InSn精确地喷射到Si晶片上，不同高度的基板上，并在不同水平上连接迹线，以及创建独立的3D结构。

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