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首页> 外文期刊>Journal oflaser Applications >Partial growth of crack in laser scribing of glass
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Partial growth of crack in laser scribing of glass

机译：玻璃激光划刻中裂纹的局部增长

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摘要

The scribing of glass by a CO_2 laser is much more effective compared to the conventional mechanical technology in use because the strength of the cut glass is improved since microcracks and particles along the cut edge are lessened. However, the crack depth of laser scribing is limited because the inner compressive stress region under the cooling area prevents median crack growth. This fact was shown by the experimental and thermal stress analyses with a finite element method (FEM) in the authors' previous study. In this study, the glass was masked partially on the scribing line so as not to generate an inner compressive stress region, and the authors found that the median crack depth of laser scribing was deeper in the experiment. Thermal stress analysis of this phenomenon was conducted by using three-dimensional FEM. As a result, the stress distribution and the phenomenon of which the median crack grew deeper corresponded qualitatively well. It has been supported that the model of laser scribing mechanism proposed in the authors' previous study is valid.
机译：与使用中的常规机械技术相比，通过CO_2激光对玻璃进行划刻更有效，因为可减少切割玻璃的强度，因为减少了沿切割边缘的微裂纹和微粒。但是，激光划片的裂纹深度有限，因为冷却区域下方的内部压缩应力区域阻止了中位裂纹的增长。作者在先前的研究中通过有限元方法（FEM）进行的实验和热应力分析表明了这一事实。在这项研究中，玻璃被部分刻在划线线上，以免产生内部压应力区域，作者发现，激光划线的平均裂纹深度在实验中更深。通过使用三维有限元法对该现象进行了热应力分析。结果，应力分布和中位裂纹扩展的现象在质量上很好地对应。已经支持作者先前研究中提出的激光划刻机制模型是正确的。

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