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首页> 外文期刊>Journal of Laser Applications >Thermal Stress Analysis On Laser Scribing Of Glass
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Thermal Stress Analysis On Laser Scribing Of Glass

机译：玻璃激光划片的热应力分析

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摘要

In the laser scribing of glass a thermal stress is introduced into a glass substrate by means of a CO_2 laser irradiation. The glass substrate is then rapidly cooled down by water jet immediately after the irradiation. For the purpose of theoretical clarification of the factors ruling the scribable condition and the crack depth, scribable conditions were acquired in laser irradiation experiments using a soda-lime glass substrate having a thickness of 0.7 mm. Furthermore, the crack depth and the crack edge profile were observed for various values of the distance between the heating area and the cooling area. On the basis of the scribable conditions obtained from the experiments results, a thermal elasticity analysis was conducted by a finite element method. The following results were obtained. The scribable condition can be estimated from the maximum tensile stress in the cooling area and the maximum temperature in the heating area. The crack depth in laser scribing depends on the tensile stress in the cooling area and the compressive stress field immediately under the area.
机译：在玻璃的激光刻划中，通过CO 2激光辐射将热应力引入玻璃基板中。然后在辐照之后立即通过水射流将玻璃基板迅速冷却。为了从理论上阐明决定可划线条件和裂纹深度的因素，在使用厚度为0.7mm的钠钙玻璃基板的激光照射实验中获得了可划线条件。此外，对于加热区域和冷却区域之间的距离的各种值，观察到裂纹深度和裂纹边缘轮廓。根据从实验结果获得的可刻划条件，通过有限元方法进行了热弹性分析。获得了以下结果。可从冷却区域中的最大拉伸应力和加热区域中的最高温度估算可划线条件。激光划刻中的裂纹深度取决于冷却区域中的拉应力和该区域正下方的压应力场。

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