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An 8-Gb/s optical backplane bus based on microchannel interconnects: design, fabrication, and performance measurements

机译:基于微通道互连的8 Gb / s光学背板总线:设计,制造和性能测量

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摘要

We describe the characteristics of a microchannel-based optical backplane including signal-to-noise ratio (SNR), interconnect distances, and data transfer rates. The backplane employs 250 /spl mu/m-spacing two-dimensional (2-D) vertical cavity surface emitting lasers (VCSELs) and a microlens array to implement 500 /spl mu/m-, 750 /spl mu/m-, and 1-mm optical beam arrays. By integrating the transmitter and a multiplexed polymeric hologram as a deflector/beam-splitter for the guided-wave optical backplane, the result demonstrates a multibus line architecture and its high-speed characteristics. Maximum interconnect distances of 6 cm and 14 cm can be achieved to satisfy 10/sup -12/ bit error rate (BER) using 2/spl times/2 beams of 500 /spl mu/m- and 1 mm-spacing array devices. The total data transfer rate of the developed backplane has shown 8 Gb/s from eye diagram measurements.
机译:我们描述了基于微通道的光背板的特性,包括信噪比(SNR),互连距离和数据传输速率。背板采用250 / spl mu / m间距的二维(2-D)垂直腔表面发射激光器(VCSEL)和微透镜阵列来实现500 / spl mu / m-,750 / spl mu / m-和1毫米光束阵列。通过将发射器和多路复用的聚合物全息图集成在一起,作为波导光背板的偏转器/光束分离器,结果证明了多总线线路架构及其高速特性。使用2 / spl次/ 2束500 / spl mu / m间距和1 mm间距的阵列器件,可以实现6 cm和14 cm的最大互连距离,以满足10 / sup -12 /误码率(BER)。根据眼图测量,已开发背板的总数据传输速率已显示为8 Gb / s。

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