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首页> 外文期刊>Journal of Materials Engineering and Performance >Interfacial Interactions Between W x N Substrates and a Gold-Tin Alloy
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Interfacial Interactions Between W x N Substrates and a Gold-Tin Alloy

机译：W x N衬底与金锡合金之间的界面相互作用

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摘要

Au-Sn is an excellent material with superior attributes and is the solder of choice, with no obvious alternatives, in many microelectronic applications. Recently, this alloy has been chosen as a potential candidate for bonding in wafer level hermetic packaging at high temperature using WN as diffusion barrier. In this application, good wetting of WN by the liquid Au-Sn alloy is a key factor for the bonding process. To this end, wetting of W x N (covered or not by a gold layer) by Au-Sn20 alloy was studied at 380 °C under high vacuum. Excellent wetting was observed when W x N was protected from oxidation by a thin Au layer. The spreading process was found to be followed by a complete dissolution of a protection layer and slight receding of the triple line. Some preliminary bonding tests using Au-Sn alloy were also performed.
机译：Au-Sn是一种具有优良特性的出色材料，是许多微电子应用中的首选焊料，没有明显的替代品。最近，该合金已被选作使用WN作为扩散阻挡层在高温下进行晶圆级气密封装的潜在候选材料。在此应用中，液态Au-Sn合金对WN的良好润湿是键合过程的关键因素。为此，在380°C的高真空下研究了Au-Sn20合金对W x （被金层覆盖或未被金层覆盖）的润湿。当W x N被薄的Au层保护免受氧化时，观察到极好的润湿性。发现铺展过程之后，保护层完全溶解，三线轻微退缩。还使用金锡合金进行了一些初步的粘结测试。

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