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首页> 外文期刊>Journal of Materials Engineering and Performance >Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys
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Wetting of Cu and Al by Sn-Zn and Zn-Al Eutectic Alloys

机译：Sn-Zn和Zn-Al共晶合金润湿Cu和Al

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摘要

Wetting properties of Sn-Zn and Zn-Al alloys on Cu and Al substrates were studied. Spreading tests were carried out for 3 min, in air and under protective atmosphere of nitrogen, with the use of fluxes. In the case of Zn-Al eutectic, spreading tests were carried out at 460, 480, 500, and 520 °C, and in the case of Sn-Zn eutectic at 250, 300, 350, 400, 450, and 500 °C, respectively. Solidified solder/substrate couples were cross-sectioned and subjected to microstructure examination. The spreading tests indicated that the wetting properties of eutectic Sn-Zn alloys, on copper pads do not depend on temperature (up to 400 °C), but in the lack of protective atmosphere, the solder does not wet the pads. Wettability studies of Zn-Al eutectic on aluminum and copper substrates have shown a negative effect of the protective nitrogen atmosphere on the wetting properties, especially for the copper pads. Furthermore, it was noted that with increasing temperature the solder wettability is improved. In addition, densities of liquid solders were studied by means of dilatometric technique.
机译：研究了Sn-Zn和Zn-Al合金在Cu和Al衬底上的润湿性能。使用助焊剂，在空气中和氮气保护气氛下，进行了3​​分钟的铺展测试。对于Zn-Al共晶，在460、480、500和520°C下进行扩散测试，对于Sn-Zn共晶，在250、300、350、400、450和500°C下进行扩散测试， 分别。固化的焊料/基板对被横截面并进行微结构检查。铺展测试表明，共晶Sn-Zn合金在铜垫上的润湿性能不依赖于温度（最高400°C），但是在缺乏保护性气氛的情况下，焊料不会润湿垫。 Zn-Al共晶在铝和铜基板上的润湿性研究表明，保护性氮气氛对润湿性能（尤其是铜焊盘）具有负面影响。此外，注意到随着温度的升高，焊料的润湿性得到改善。另外，通过膨胀法研究了液态焊料的密度。

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