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首页> 外文期刊>Journal of Materials Engineering and Performance >Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering
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Current Problems and Possible Solutions in High-Temperature Lead-Free Soldering

机译：高温无铅焊接的当前问题和可能的解决方案

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摘要

The substitution of lead in the electronics industry is one of the key issues in the current drive towards ecological manufacturing. Legislation has already banned the use of lead in solders for mainstream applications (T M ≈ 220 °C), but the use of lead in the solders for high-temperature applications (85% lead, T M ≈ 250-350 °C) is still exempt in RoHS2. The search for proper substitutes has been ongoing among solder manufacturers only for a decade without finding a viable low cost alternative and is the subject of intensive research. This article tries to map the current situation in the field of high-temperature lead-free soldering, presenting a short review of current legislation, requirements for substitute alloys, and finally it describes some existing solutions both in the field of promising new materials and new technologies. Currently, there is no drop-in replacement for lead-containing solders and therefore both the new materials and the new technologies may be viable solutions for production of reliable lead-free joints for high-temperature applications.
机译：电子行业中铅的替代是当前向生态制造业发展的关键问题之一。立法已经禁止在主流应用（TM ≈220°C）的焊料中使用铅，但在高温应用（> 85％Lead，TM ）的焊料中使用铅RoHS2仍免除250-350°C）。在焊料制造商中，寻找合适的替代品仅持续了十年之久，却没有找到可行的低成本替代品，这是深入研究的主题。本文试图绘制高温无铅焊接领域的现状，简要回顾一下当前法规，替代合金的要求，最后介绍了在有前途的新材料和新领域中的一些现有解决方案。技术。当前，没有任何替代品可替代含铅焊料，因此，无论是新材料还是新技术，都是生产用于高温应用的可靠无铅接头的可行解决方案。

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