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Study on fracture toughness of 617 Ni-based alloy welded joint under different elevated temperatures

机译:不同升高温度下617镍合金焊接接头的裂缝韧性研究

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摘要

The fracture toughness of 617 Ni-based weld metal (WM) under different elevated temperatures was tested with a novel method and its fracture mechanism was investigated in this paper. It was found that the fracture toughness of WM was lower than that of base metal (BM) at the same temperature, which was mainly due to the coarse columnar structure, differences in misorientation, and precipitated phases. For both BM and WM, the fracture toughness was lower at elevated temperature due to decreased strength. Much more micro-voids caused by Ti(C, N) and M_(23)C_6 inside grains of BM could be observed adjacent to the crack path, which accounted for the dramatically decreased fracture toughness of BM at elevated temperature. In comparison, fewer micro-voids could be observed in WM due to the lack of those second particles. As a result, the J_(0.2) value and propagation path morphology both showed that the WM had more stable microstructure even though possessing lower toughness.
机译:用新的方法测试不同升高的温度下的617 Ni基焊接金属(WM)的断裂韧性,并在本文中研究了其骨折机理。发现Wm的断裂韧性低于相同温度的基础金属(BM)的骨折韧性,主要是由于粗柱状结构,有机化的差异和沉淀相。对于BM和WM,由于强度降低,升高的耐高温下断裂韧性较低。在裂纹路径附近可以观察到BM内部的Ti(C,N)和M_(23)C_6引起的微空隙,这占升高的温度下BM的显着降低的裂缝韧性。相比之下,由于缺乏那些第二颗粒,可以在WM中观察到更少的微空隙。结果,J_(0.2)值和传播路径形态显示,即使具有较低的韧性,WM也具有更稳定的微观结构。

著录项

  • 来源
    《Journal of Materials Research》 |2020年第14期|1790-1802|共13页
  • 作者单位

    Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

    Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

    Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

    Joining & Welding Research Institute Osaka University Osaka 567-0047 Japan;

    Shanghai Key Laboratory of Materials Laser Processing and Modification School of Materials Science and Engineering Shanghai Jiao Tong University Shanghai 200240 PR China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
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