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Hardening mechanisms in irradiated Cu-W alloys

机译：辐照铜钨合金的硬化机理

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摘要

This work investigates the relative contributions to strengthening from twinning, solid-solution, precipitation, and irradiation hardening mechanisms in sputtered Cu-W thin films irradiated to different doses. A nanograin solid solution strengthening mechanism with a linear compositional dependence is observed for the as-grown alloys and for the alloy samples irradiated to 0.5 dpa. Solid solution strengthening is the major strengthening mechanism for Cu99.5W0.5 at all irradiation doses. Irradiation induces precipitation in samples with W concentrations greater than or equal to 1% at doses above ≈0.5 dpa. The growth of 1-4 nm precipitates enhances the hardness of these alloys, and the degree of strengthening is determined by the interparticle spacing. While the alloys exhibit steady-state properties after a relatively low dose (≈1 dpa), the different time scales associated with detwinning and damage accumulation in pure Cu lead transients at higher doses (>5 dpa).
机译：这项工作调查了不同剂量的溅射Cu-W薄膜对孪晶，固溶，沉淀和辐照硬化机制对强化的相对贡献。对于刚生长的合金和辐照至0.5 dpa的合金样品，观察到了具有线性组成依赖性的纳米晶粒固溶体强化机理。固溶强化是所有照射剂量下Cu99.5W0.5的主要强化机理。辐照会在≈0.5dpa以上的剂量下，在W浓度大于或等于1％的样品中引起沉淀。 1-4 nm沉淀物的生长提高了这些合金的硬度，而强化程度则取决于颗粒间的间距。尽管合金在较低剂量（≈1 dpa）后表现出稳态特性，但在较高剂量（> 5 dpa）下，纯铜铅瞬态中的解缠和损伤累积相关的时间尺度不同。

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  • 来源
    《Journal of Materials Research》 |2017年第16期|3156-3164|共9页
  • 作者

    Jawaharram Gowtham Sriram; Dillon Shen J.; Averback Robert S.;

  • 作者单位

    Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, United States;

    Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, United States;

    Department of Materials Science and Engineering, University of Illinois Urbana-Champaign, Urbana, IL, United States;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

    Cu; nano-indentation; radiation effects;

    机译：铜纳米压痕辐射效应;

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