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Indentation damage evaluation on metal-coated thin-films stacked structure

机译：金属涂层薄膜堆叠结构的压痕损伤评估

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摘要

A micro-indentation system integrated with an acoustic emission (AE) sensor is used as a damage test method for crack detection of the specimen during the indentation loading-unloading cycle. The specimens investigated are the Si die, and various stacked structures of metallization (Al or Cu) deposited over the dielectric layers (SiO_2 or Si_3N_4) on the Si substrate. The 1st AE event detected during the loading stage corresponded to the 'pop-in' observation in the force-displacement curve, which was related to the brittle cracking in the dielectric or Si substrate. However, during unloading, a 2nd AE event was detected, but no "pop-out" was observed, which was mainly due to the delamination between the dielectric and Si substrate. It was also found that for Si die, "pop-out" was observed without any AE event during the unloading stage, which was related to the Si phase transformation. This observation is unique to sharp indenter tip but not for a blunt indenter tip.
机译：集成有声发射（AE）传感器的微压痕系统被用作损伤测试方法，用于在压痕加载/卸载循环中检测样品的裂纹。所研究的样品是Si裸片，以及沉积在Si基板上的电介质层（SiO_2或Si_3N_4）上的各种金属化堆叠结构（Al或Cu）。在加载阶段检测到的第一个AE事件对应于力-位移曲线中的“弹出”观察，这与电介质或Si基板中的脆性裂纹有关。然而，在卸载过程中，检测到第二次AE事件，但未观察到“弹出”现象，这主要归因于电介质和Si基板之间的分层。还发现，对于Si芯片，在卸载阶段观察到“弹出”而没有任何AE事件，这与Si相变有关。这种观察是尖锐的压头尖端所独有的，而不是钝的压头尖端所独有的。

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  • 来源
    《Journal of Materials Research》 |2015年第20期|3071-3083|共13页
  • 作者

    Alfred Yeo; Mao Liu; Kun Zhou;

  • 作者单位

    Operation Backend Development, Infineon Technologies Asia Pacific Pte Ltd, Singapore 349253 and School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798;

    School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798;

    School of Mechanical and Aerospace Engineering, Nanyang Technological University, Singapore 639798;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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  • 正文语种 eng
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