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Influences of brush plating solutions composition and technological parameters on the quality of rolled copper foil surface coatings

机译:电刷镀液组成和工艺参数对轧制铜箔表面涂层质量的影响

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摘要

The technologies of brush plating and dealloying were used to treat the surface of rolled copper foil. Zn-Ni and Sn-Zn alloy coatings were prepared. The laws of plating solutions composition and technological parameters on coatings quality were investigated. The results show that with the decreasing of main elements mass ratio or increasing of brush time, thickness and corrosion resistance of Zn-Ni alloy coating increase. With the increasing of brush plating voltage or time, surface roughness of Sn-Zn alloy coating decreases. Turning up brush plating voltage could raise deposition rate of sub-tin and zinc ions and refine surface grains of coating. The angle of dealloying has the significant effect'on the roughness of dealloyed Sn-Zn alloy coating. As the dealloying angle increases, surface roughness of dealloyed Sn-Zn alloy coating increases. The contribution of dealloying time to surface roughness of treated coating is obviously larger than that of corrosion solution concentration.
机译:刷镀和脱合金技术用于处理轧制铜箔的表面。制备了Zn-Ni和Sn-Zn合金涂层。研究了镀液组成和工艺参数对镀层质量的规律。结果表明,随着主要元素质量比的降低或电刷时间的增加,Zn-Ni合金镀层的厚度和耐蚀性均增加。随着电刷镀电压或时间的增加,Sn-Zn合金涂层的表面粗糙度降低。提高电刷镀电压可以提高亚锡和锌离子的沉积速率,并细化涂层的表面晶粒。脱合金的角度对脱合金的Sn-Zn合金涂层的粗糙度有显着影响。随着脱合金角的增加,脱合金Sn-Zn合金涂层的表面粗糙度增加。脱合金时间对处理过的涂层表面粗糙度的贡献明显大于腐蚀液浓度。

著录项

  • 来源
    《Journal of Materials Research》 |2015年第24期|3766-3775|共10页
  • 作者

    Wenjing Wang; Xuefeng Liu;

  • 作者单位

    Laboratory of Advanced Processing Technology of Materials (LAPTM), School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China;

    Laboratory of Advanced Processing Technology of Materials (LAPTM), School of Materials Science and Engineering, University of Science and Technology Beijing, Beijing 100083, People's Republic of China and Beijing Laboratory of Metallic Materials and Processing for Modern Transportation, University of Science and Technology Beijing, Beijing 100083, People's Republic of China;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
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