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Emerging materials for microelectromechanical systems at elevated temperatures

机译:高温下用于微机电系统的新兴材料

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摘要

Extension of microelectromechanical systems (MEMS) into more extreme operating conditions will require a wider range of material properties than are currently available in conventional systems. Successful integration of new materials is dependent on concurrent development of compatible fabrication routes and scale appropriate evaluation techniques. This review focuses on emerging material classes that have potential to replace silicon-based MEMS in elevated temperature applications. Basic silicon mechanical properties and micromachining methods are reviewed to provide context for developing material systems such as silicon carbide, silicon carbonitrides, and several nickel-based alloys. Potential improvements in strength, thermal stability, and reliability are juxtaposed with fabrication, reproducibility, and economic feasibility issues that must also be addressed.
机译:将微机电系统(MEMS)扩展到更极端的工作条件将需要比常规系统中当前更广泛的材料性能。新材料的成功集成取决于同时开发兼容的制造工艺并扩展适当的评估技术。这篇综述集中在新兴的材料类别上,这些材料类别有可能在高温应用中替代基于硅的MEMS。回顾了基本的硅机械性能和微加工方法,为开发诸如碳化硅,碳氮化硅和几种镍基合金等材料系统提供了背景。强度,热稳定性和可靠性方面的潜在改进与制造,可复制性以及必须解决的经济可行性问题并列。

著录项

  • 来源
    《Journal of Materials Research》 |2014年第15期|1597-1608|共12页
  • 作者单位

    Mechanical Engineering Department, Johns Hopkins University, Baltimore, Maryland, USA;

    GE Global Research, Niskayuna, New York, USA;

    Mechanical Engineering Department, Johns Hopkins University, Baltimore, Maryland, USA;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
  • 原文格式 PDF
  • 正文语种 eng
  • 中图分类
  • 关键词

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