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Electrical and mechanical properties of free-standing PMMA-MMT clay composites

机译：独立式PMMA-MMT粘土复合材料的电气和机械性能

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摘要

Modified MMT clay-doped PMMA composites have been prepared by solvent casting method for different weight percentages. The prepared composite films were characterized by FTIR and SEM. Also, the DC conductivity was carried out for PMMA and PMMA composite films. Among all composites, it was found that 30 wt% shows highest conductivity of 1.59 × 10~(-3) S/cm. The negative thermal coefficient behavior of these polymer composite films confirms that the increase in conductivity is due to the elongation of polymer chain which helps in charge transport mechanism. Dielectric study also shows that 30 wt% has the lowest dielectric constant and dielectric loss of 2.5 and 3.3, respectively, resulting in an increase in conductivity of 5 × 10~(-3) S/cm. The isotropic nature of 30 wt% composite film shows a high quality factor of 0.005 because of overdamping of electron at 10~4 Hz. Cole-cole plots show that the semi arc originated from a single point and its area decreases with filler concentration up to 30 wt% due to drop in the electrical resistance. Tensile modulus increases because of high MMT aspect ratio and distribution ratio. The 30 wt% of the composite shows high tensile strength at 55 MPa which induces 8% of strain in the PMMA-MMT clay composite films. Therefore, these composite films can be used in many sensor and solar technologies as encapsulation materials.
机译：通过溶剂浇铸法制备了不同重量百分比的改性MMT粘土掺杂PMMA复合材料。用FTIR和SEM对制备的复合膜进行了表征。另外，对PMMA和PMMA复合膜进行了DC导电性。在所有复合材料中，发现30 wt％的导电率最高为1.59×10〜（-3）S / cm。这些聚合物复合膜的负热系数行为证实，电导率的增加归因于聚合物链的延长，这有助于电荷传输机制。介电研究还表明，30 wt％的介电常数和介电损耗最低，分别为2.5和3.3，导致电导率增加5×10〜（-3）S / cm。 30％（重量）复合膜的各向同性性质由于在10〜4 Hz时电子过度阻尼而显示出0.005的高品质因数。科尔-科尔图表明，半圆弧起源于一个点，由于电阻的降低，其填充物浓度高达30 wt％时其面积减小。由于高的MMT长径比和分布比，拉伸模量增加。 30wt％的复合材料在55MPa下显示出高的拉伸强度，这在PMMA-MMT粘土复合材料膜中引起了8％的应变。因此，这些复合膜可在许多传感器和太阳能技术中用作封装材料。

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  • 来源
    《Journal of Materials Research》 |2014年第24期|2957-2964|共8页
  • 作者

    Syed Abusale Mhamad Nabirqudri; Aashis S. Roy; M.V.N. Ambika Prasad;

  • 作者单位

    Department of Materials Science, Gulbarga University, Gulbarga 585106, India, and Department of Mechanical, KBN College of Engineering, Gulbarga 585104, Karnataka, India;

    Department of Materials Science, Gulbarga University, Gulbarga 585106, India;

    Department of Materials Science, Gulbarga University, Gulbarga 585106, India;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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