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机译:局部晶粒取向不良和β-Sn弹性各向异性对晶须和小丘形成的影响
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907;
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907;
Naval Surface Warfare Center Crane Division, Crane, Indiana 47522;
Component Quality and Technology, Cisco Systems, Inc., San Jose, California 95134;
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907;
School of Materials Engineering, Purdue University, West Lafayette, Indiana 47907;
机译:Sn晶须/小丘形成过程中表面,界面,晶粒结构和应变/应力演化的原位同步加速器微衍射研究
机译:表面形态演变与晶粒结构的相关性:Sn-Cu中的晶须/ Hillock形成
机译:表面形态演变与晶粒结构的相关性:Sn-Cu中的晶须/ Hillock形成
机译:电镀Sn和Sn-Cu膜中的晶须,小丘和薄膜应力进化
机译:局部薄膜性质对锡晶须和小丘成核和生长的影响
机译:扫描过程中3DXRD扫描测量锡晶须周围晶粒生长应力和Cu6Sn5的形成
机译:谷物边界迁移率的误导性依赖性:弹性各向异性的作用
机译:热压si(sub 3)N(sub 4)复合材料的弹性各向异性:原位(β)-si(sub 3)N(sub 4)晶粒和添加的β-si(sub 3)N的作用( sub 4)胡须