Formation of interfacial η'-Cu_6Sn_5 in Sn-0.7Cu/Cu solder joints during isothermal aging

著录项

• 来源
  《Journal of Materials Research》 |2011年第12期|p.1468-1471|共4页
• 作者

  Zhongbing Luo; Lai Wang; Qinqin Fu; Chongqian Cheng; Jie Zhao;

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• 作者单位

  School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China;

  School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China;

  School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China;

  School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China;

  School of Materials Science and Engineering, Dalian University of Technology, Dalian 116085, China;

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• 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
• 原文格式 PDF
• 正文语种 eng
• 中图分类
• 关键词