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首页> 外文期刊>Journal of Materials Research >Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates
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Evolution of microstructure and stress of and associated whisker growth on Sn layers sputter-deposited on Cu substrates

机译：溅射沉积在铜基体上的锡层的组织和应力以及晶须生长的演变

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摘要

After sputter deposition of Sn (layer thickness of 350 nm) on Cu substrates and during subsequent aging at room temperature, Cu and Sn reacted to form the intermetallic phase Cu_6Sn_5 in the Sn layer at the Cu/Sn interface, which led within a few hours of aging to the development of a compressive stress parallel to the Cu/Sn interface in the Sn layer. One day after aging at room-temperature whisker formation occurred on the surface of the Sn layer. It was shown that whisker growth is associated with long-range Sn diffusion parallel to the Cu/Sn interface. Sn layers of the same thickness sputter deposited on pure Si substrates exhibited throughout the same aging time at room temperature a tensile stress parallel to the Cu/Sn interface (no intermetallic phase formation took place) and whisker formation did not occur. The interrelationship of intermetallic compound formation, stress development, and whisker growth is discussed.
机译：在铜衬底上溅射沉积Sn（层厚度为350 nm）并随后在室温下老化之后，Cu和Sn反应，在Cu / Sn界面的Sn层中形成金属间相Cu_6Sn_5，并在数小时内引出老化与平行于Sn层中Cu / Sn界面的压应力的发展有关。在室温下老化一天后，在锡层表面上形成晶须。结果表明，晶须生长与平行于Cu / Sn界面的长距离Sn扩散有关。在室温下，在相同的时效时间内，在纯Si衬底上溅射沉积的相同厚度的Sn层会表现出与Cu / Sn界面平行的拉伸应力（不会发生金属间相形成）和晶须的形成。讨论了金属间化合物形成，应力发展和晶须生长的相互关系。

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  • 来源
    《Journal of Materials Research》 |2010年第11期|p.2166-2174|共9页
  • 作者

    M. Sobiech; C. Krueger; U. Welzel; J.Y. Wang; E.J. Mittemeijer; W. Huegel;

  • 作者单位

    Max Planck Institute for Metals Research, D-70569 Stuttgart, Germany,Robert Bosch GmbH,D-72770 Reutlingen, Germany;

    rnInstitute for Materials Science, University of Stuttgart, D-70569 Stuttgart, Germany;

    rnMax Planck Institute for Metals Research, D-70569 Stuttgart, Germany;

    rnMax Planck Institute for Metals Research, D-70569 Stuttgart, Germany;

    rnMax Planck Institute for Metals Research, D-70569 Stuttgart, Germany,Institute for Materials Science, University of Stuttgart, D-70569 Stuttgart, Germany;

    rnRobert Bosch GmbH, D-72770 Reutlingen, Germany;

  • 收录信息 美国《科学引文索引》(SCI);美国《工程索引》(EI);美国《生物学医学文摘》(MEDLINE);
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